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AWT6274R, AWT6275RM20, AWT6276

Table of contents:
Info of AWT6274R
Info of AWT6275RM20
Info of AWT6276

AWT6274R, AWT6275RM20, AWT6276 Selling Leads, Datasheet

MFG:ANADIGIC Package Cooled:LLP10 D/C:05+

AWT6274R, AWT6275RM20, AWT6276 Datasheet download

Five Points

Part Number: AWT6274R

MFG: ANADIGIC

Package Cooled: LLP10

D/C: 05+

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AWT6276 General Description

The AWT6276 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm? 6275 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, increase handset talk and standby time. The self-contained 4 mm x 4 mm x 1 mm surface mount package incorporates matching networks optimized for output power, efficiency, and linearity in a 50 system.

AWT6276 Maximum Ratings

Frequency (MHz)	1850 - 1910
Peak HSPA Output Power (dBm)	28.5
Power Added Efficiency (%)	45% @ +29.5 dBm 21% @ +16 dBm 16% @ +7 dBm
Icq (mA)	15
Package (mm)	4 x 4 x 1

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