BB504MDS, BB505C, BB505M Selling Leads, Datasheet
MFG:HITACHI Package Cooled:SOT-143 D/C:05+
BB504MDS, BB505C, BB505M Datasheet download
Part Number: BB504MDS
MFG: HITACHI
Package Cooled: SOT-143
D/C: 05+
BB504MDS, BB505C, BB505M
- Table of contents:
Info of BB504MDS
Info of BB505C
Info of BB505M
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About BB501
PDF/DataSheet Download
Datasheet: BB501
File Size: 72751 KB
Manufacturer: HITACHI [Hitachi Semiconductor]
Download : Click here to Download
About BB505CES
PDF/DataSheet Download
Datasheet: BB505CES
File Size: 112270 KB
Manufacturer: Renesas Technology Corp
Download : Click here to Download
About BB501
PDF/DataSheet Download
Datasheet: BB501
File Size: 72751 KB
Manufacturer: HITACHI [Hitachi Semiconductor]
Download : Click here to Download
BB505C Maximum Ratings
| Item |
Symbol |
Ratings |
Unit |
| Drain to source voltage |
VDS |
6 |
V |
| Gate1 to source voltage |
VG1S |
+6 0 |
V |
| Gate2 to source voltage |
VG2S |
+6 0 |
V |
| Drain current |
ID |
20 |
mA |
| Channel power dissipation |
Pchnote3 |
250 |
mW |
| Channel temperature |
Tch |
150 |
°C |
| Storage temperature |
Tstg |
55 to +150 |
°C |
BB505C Features
• Build in Biasing Circuit; To reduce using parts cost & PC board space.
• Low noise; NF = 1.5 dB typ. at f = 900 MHz
• High gain; PG = 24 dB typ. at f = 900 MHz
• Withstanding to ESD; Build in ESD absorbing diode. Withstand up to 190 V at C = 200 pF, Rs = 0 conditions.
• Provide mini mold packages; CMPAK-4 (SOT-343mod)
• Low noise; NF = 1.5 dB typ. at f = 900 MHz
• High gain; PG = 24 dB typ. at f = 900 MHz
• Withstanding to ESD; Build in ESD absorbing diode. Withstand up to 190 V at C = 200 pF, Rs = 0 conditions.
• Provide mini mold packages; CMPAK-4 (SOT-343mod)
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