BUW12AF, BUW12F, BUW13 Selling Leads, Datasheet
MFG:PHIL/ST/MOT Package Cooled:TO-3P D/C:03+
BUW12AF, BUW12F, BUW13 Datasheet download
Part Number: BUW12AF
MFG: PHIL/ST/MOT
Package Cooled: TO-3P
D/C: 03+
MFG:PHIL/ST/MOT Package Cooled:TO-3P D/C:03+
BUW12AF, BUW12F, BUW13 Datasheet download
MFG: PHIL/ST/MOT
Package Cooled: TO-3P
D/C: 03+
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PDF/DataSheet Download
Datasheet: BUW12AF
File Size: 83579 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BUW12F
File Size: 83579 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BUW13A
File Size: 22298 KB
Manufacturer: WINGS [Wing Shing Computer Components]
Download : Click here to Download
SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
VCESM | Collector-emitter voltage peak value BUW12F BUW12AF |
VBE = 0 | - - |
850 1000 |
V V |
VCEO | Collector-emitter voltage BUW12F BUW12AF |
open base | - - |
400 450 |
V V |
ICsat | collector saturation current BUW12F BUW12AF |
VCE= 1.5 V | - - |
6 5 |
A A |
IC | base current (DC) | see Figs 2 and 5 | - | 8 | A |
ICM | base current (peak value) | see Fig 2 | - | 20 | A |
IB | base current (DC) | - | 4 | A | |
IBM | base current (peak value) | - | 6 | A | |
Ptot | total power dissipation | Th 25; see Fig.4; note 1 | - | 34 | W |
Th 25; see Fig.4; note 2 | 45 | W | |||
Tstg | storage temperature | -65 | +150 | ||
Tj | junction temperature | - | 150 |
Notes
1. Mounted without heatsink compound and 30 ±5 N force on centre of package.
2. Mounted with heatsink compound and 30 ±5 N force on centre of package.
SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
VCESM | Collector-emitter voltage peak value BUW12F BUW12AF |
VBE = 0 | - - |
850 1000 |
V V |
VCEO | Collector-emitter voltage BUW12F BUW12AF |
open base | - - |
400 450 |
V V |
ICsat | collector saturation current BUW12F BUW12AF |
VCE= 1.5 V | - - |
6 5 |
A A |
IC | base current (DC) | see Figs 2 and 5 | - | 8 | A |
ICM | base current (peak value) | see Fig 2 | - | 20 | A |
IB | base current (DC) | - | 4 | A | |
IBM | base current (peak value) | - | 6 | A | |
Ptot | total power dissipation | Th 25; see Fig.4; note 1 | - | 34 | W |
Th 25; see Fig.4; note 2 | 45 | W | |||
Tstg | storage temperature | -65 | +150 | ||
Tj | junction temperature | - | 150 |
Notes
1. Mounted without heatsink compound and 30 ±5 N force on centre of package.
2. Mounted with heatsink compound and 30 ±5 N force on centre of package.
SYMBOL |
PARAMETER |
CONDITIONS |
VALUE |
UNIT | |
VCBO |
Collector-base voltage |
BUW13 |
Open emitter |
850 |
V |
BUW13A |
1000 | ||||
VCEO |
Collector-emitter voltage |
BUW13 |
Open base |
400 |
V |
BUW13A |
450 | ||||
VEBO |
Emitter-base voltage |
Open collector |
9 |
V | |
IC |
Collector current |
15 |
A | ||
ICM |
Collector current-peak |
30 |
|||
IB |
Base current |
6 |
A | ||
IBM |
Base current-peak |
9 |
A | ||
Ptot |
Total power dissipation |
TC =25 |
175 |
W | |
Tj |
Junction temperature |
150 |
|||
Tstg |
Storage temperature |
-65~175 |