MFG:PHILIPS Package Cooled:08+ D/C:25000
MFG: PHILIPS
Package Cooled: 08+
D/C: 25000
Qty: 10000
Tel: 86-755-28536689
Adddate: 2010-03-22
MFG: PH Package Cooled: SOD-81 D/C: 02+95+02+ Qty: 15124 Note: ★★★new & original package in stock★★★
East Port International Co.,Ltd 
Tel: 86-755-83613656
Adddate: 2010-03-22
MFG: PHILIPS D/C: 08+ Qty: 25000
Golden Parts Technology Co.,Ltd 
Tel: 86-755-83954357/82546251
Adddate: 2010-03-22
MFG: GULF Package Cooled: SOD-57 D/C: 2007 Qty: 80,000 Note: original parts in stock
Tel: 86-010-62566594
Adddate: 2010-03-22
MFG: PHILIPS D/C: 09+ Qty: 150000
ICBUSINESS IC Business World Co.,Ltd 
Tel: 86-755-82500004
Adddate: 2010-03-22
MFG: PHILIPS Package Cooled: N/A D/C: SOD Qty: 25000
SHENZHEN XINMED ELECTRONICS CO.,LTD 
Tel: 86-755-21233083
Adddate: 2010-03-22
MFG: ph Package Cooled: ph D/C: dc95 Qty: 4590
Asia World Trade Technology Source 
Tel: 086-0755-25573524
Adddate: 2010-03-22
PDF/DataSheet Download
Datasheet: BYD33D
File Size: 67468 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
MFG: PH ? D/C: . Qty: 360000
HuaZhu Technology (INT'L) Limited 
Tel: 86-755-88397879
Adddate: 2010-03-22
Qty: 598
TACT (H.K.) Century Co., Limited 
Tel: 0086-0755-83014280
Adddate: 2010-03-22
MFG: PHILIPS Package Cooled: DIP D/C: 03+;04+ Qty: 55079 Note: ★★★new & original package in stock★★★
East Port International Co.,Ltd 
Tel: 86-755-83613656
Adddate: 2010-03-22
MFG: PHILIPS D/C: 08+ Qty: 55000
Golden Parts Technology Co.,Ltd 
Tel: 86-755-83954357/82546251
Adddate: 2010-03-22
MFG: GULF Package Cooled: SOD-57 D/C: 2007 Qty: 56,000 Note: original parts in stock
Tel: 86-010-62566594
Adddate: 2010-03-22
MFG: PHI D/C: 09+ Qty: 1352 Note: NEW,SHENZHEN"
Tel: 86-755-82702662
Adddate: 2010-03-22
MFG: PHILIPS D/C: 09+ Qty: 150000
ICBUSINESS IC Business World Co.,Ltd 
Tel: 86-755-82500004
Adddate: 2010-03-22
MFG: PHI Package Cooled: SOD81 600V D/C: Skype: loismai@126.com Qty: 67000 Note: Stock
Tel: 0086-755-28222051
Adddate: 2010-03-22
PDF/DataSheet Download
Datasheet: BYD33J
File Size: 67468 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
Qty: 595
TACT (H.K.) Century Co., Limited 
Tel: 0086-0755-83014280
Adddate: 2010-03-22
MFG: PH Package Cooled: 玻封 D/C: 05+ Qty: 15079 Note: ★★★new & original package in stock★★★
East Port International Co.,Ltd 
Tel: 86-755-83613656
Adddate: 2010-03-22
MFG: ph Package Cooled: ph D/C: dc98 Qty: 200
Asia World Trade Technology Source 
Tel: 086-0755-25573524
Adddate: 2010-03-22
MFG: GULF Package Cooled: SOD-57 D/C: 2007 Qty: 80,000 Note: original parts in stock
Tel: 86-010-62566594
Adddate: 2010-03-22
MFG: PHILIPS D/C: 09+ Qty: 15000
ICBUSINESS IC Business World Co.,Ltd 
Tel: 86-755-82500004
Adddate: 2010-03-22
MFG: PHILIPS D/C: O9+ Qty: 500000 Note:
SHENZHEN KJX Electronic Co.,Lt 
Tel: 00086-0755-82985878
Adddate: 2010-03-22
MFG: ph Package Cooled: ph D/C: dc95 Qty: 4590
Asia World Trade Technology Source 
Tel: 086-0755-25573524
Adddate: 2010-03-22
PDF/DataSheet Download
Datasheet: BYD33G
File Size: 67468 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
| SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
| VRRM | repetitive peak reverse voltage | 200 | V | ||
| VR | crest working reverse voltage | 200 | V | ||
| I F(AV) | average forward current | Ttp =55 °C; lead length = 10 mm; see Figs 2; 3 and 4 averaged over any 20 ms period; see also Figs 14; 15 and 16 |
1.30 | A | |
| I F(AV) | average forward current | Tamb =65 °C; PCB mounting (see Fig.25); see Figs 5; 6 and 7 averaged over any 20 ms period; see also Figs 14; 15 and 16 |
0.70 | A | |
| IFRM | repetitive peak forward current | Ttp =65 °C; see Fig.6 | 12 | A | |
| IFRM | repetitive peak forward current | Tamb =60 °C; see Fig.7 | 7 | A | |
| IFSM | non-repetitive peak forward current | t = 10 ms half sine wave; Tj =Tj max prior to surge; VR =VRRMmax |
90 | A | |
| ERSM | non-repetitive peak reverse avalanche energy |
L = 120 mH; Tj =Tj max prior to surge;inductive load switched off | 10 | mJ |
| Tstg | storage temperature | -65 | +175 | ℃ | |
| Tj | operating junction temperature | see Figs 17 and 18 | -65 | 175 | ℃ |
* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* Available in ammo-pack.

Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
| SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
| VRRM | repetitive peak reverse voltage | 400 | V | ||
| VR | crest working reverse voltage | 400 | V | ||
| I F(AV) | average forward current | Ttp =55 °C; lead length = 10 mm; see Figs 2; 3 and 4 averaged over any 20 ms period; see also Figs 14; 15 and 16 |
1.30 | A | |
| I F(AV) | average forward current | Tamb =65 °C; PCB mounting (see Fig.25); see Figs 5; 6 and 7 averaged over any 20 ms period; see also Figs 14; 15 and 16 |
0.70 | A | |
| IFRM | repetitive peak forward current | Ttp =65 °C; see Fig.6 | 12 | A | |
| IFRM | repetitive peak forward current | Tamb =60 °C; see Fig.7 | 7 | A | |
| IFSM | non-repetitive peak forward current | t = 10 ms half sine wave; Tj =Tj max prior to surge; VR =VRRMmax |
90 | A | |
| ERSM | non-repetitive peak reverse avalanche energy |
L = 120 mH; Tj =Tj max prior to surge;inductive load switched off | 10 | mJ |
| Tstg | storage temperature | -65 | +175 | ℃ | |
| Tj | operating junction temperature | see Figs 17 and 18 | -65 | 175 | ℃ |
* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* Available in ammo-pack.

Cavity free cylindrical glass SOD87 package through Implotec(TM)(1) technology. The SOD87 package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
| SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
| VRRM | repetitive peak reverse voltage | 600 | V | ||
| VR | crest working reverse voltage | 600 | V | ||
| I F(AV) | average forward current | Ttp =55 °C; lead length = 10 mm; see Figs 2; 3 and 4 averaged over any 20 ms period; see also Figs 14; 15 and 16 |
1.30 | A | |
| I F(AV) | average forward current | Tamb =65 °C; PCB mounting (see Fig.25); see Figs 5; 6 and 7 averaged over any 20 ms period; see also Figs 14; 15 and 16 |
0.70 | A | |
| IFRM | repetitive peak forward current | Ttp =65 °C; see Fig.6 | 12 | A | |
| IFRM | repetitive peak forward current | Tamb =60 °C; see Fig.7 | 7 | A | |
| IFSM | non-repetitive peak forward current | t = 10 ms half sine wave; Tj =Tj max prior to surge; VR =VRRMmax |
90 | A | |
| ERSM | non-repetitive peak reverse avalanche energy |
L = 120 mH; Tj =Tj max prior to surge;inductive load switched off | 10 | mJ |
| Tstg | storage temperature | -65 | +175 | ℃ | |
| Tj | operating junction temperature | see Figs 17 and 18 | -65 | 175 | ℃ |
* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* Available in ammo-pack.
