DAC8042ES, DAC80430, DAC8043A Selling Leads, Datasheet
MFG:AD Package Cooled:SMD-16 D/C:03+
DAC8042ES, DAC80430, DAC8043A Datasheet download

Part Number: DAC8042ES
MFG: AD
Package Cooled: SMD-16
D/C: 03+
MFG:AD Package Cooled:SMD-16 D/C:03+
DAC8042ES, DAC80430, DAC8043A Datasheet download

MFG: AD
Package Cooled: SMD-16
D/C: 03+
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PDF/DataSheet Download
Datasheet: DAC02310
File Size: 343882 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: DAC02310
File Size: 343882 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: DAC8043A
File Size: 140300 KB
Manufacturer: AD [Analog Devices]
Download : Click here to Download
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V, +8 V
VREF to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±18 V
RFB to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. ±18 V
Logic Inputs to GND . . . . . . . . . . . . . . ..0.3 V, VDD + 0.3 V
VIOUT to GND . . . . . . . . . . . . . . . . . . . ..0.3 V, VDD + 0.3 V
IOUT Short Circuit to GND . . . . . . . . . . . . . . . . . . . . ... 50 mA
Package Power Dissipation . . . . . . . . . . . .(TJ max TA)/qJA
Thermal Resistance qJA
8-Lead Plastic DIP Package (N-8) . . . . . . . . . . ..........103/W
8-Lead SOIC Package (SO-8) . . . . . . . . . . . . . . . ......158/W
TSSOP-8 Package (RU-8) . . . . . . . . . . . . . . . . . . .......240/W
Maximum Junction Temperature (TJ max) . . . . . . . . .....+150
Operating Temperature Range . . . . . . . . . . .... 40to +85
Storage Temperature Range . . . . . . . . . . . . ...65to +150
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . .....+300
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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