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FDB33N10, FDB33N25, FDB33N25TM

FDB33N10, FDB33N25, FDB33N25TM Selling Leads, Datasheet

MFG:Fairchild Semiconductor (VA)  Category:Discrete Semiconductor Products  Package Cooled:TO-263  D/C:.

FDB33N25TM Picture

FDB33N10, FDB33N25, FDB33N25TM Datasheet download

Five Points

Part Number: FDB33N25TM

Category: Discrete Semiconductor Products

MFG: Fairchild Semiconductor (VA)

Package Cooled: TO-263

D/C: .

Description: MOSFET N-CH 250V 33A D2PAK

 

 
 
 
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  • FDB047N10

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About FDB035AN06A0

PDF/DataSheet Download

Datasheet: FDB035AN06A0

File Size: 242063 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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  • Vendor: Fairchild D/C: 09+& Qty: 800  Adddate: 2024-04-28
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  • SP&J   South
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  • FDB047N10

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  • TODENKI ELECTRONICS COMPANY   China
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About FDB33N25

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Datasheet: FDB33N25

File Size: 705212 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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  • FDB33N25TM

  • Vendor: Fairchild D/C: 09+& Qty: 800  Adddate: 2024-04-28
  • Inquire Now
  • SP&J   South
    Contact: Ms.Julie  
    Tel: 82-2-6679-6106
    Fax: --
    (7)
  • FDB047N10

  • Vendor: FSC Pack: Original D/C: 12+& Qty: 800000  Adddate: 2024-04-28
  • Inquire Now
  • TODENKI ELECTRONICS COMPANY   China
    Contact: Ms.Alice  
    Tel: 86-755-82565937
    Fax: 86-755-83206987
    (14)

About FDB33N25TM

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Datasheet: FDB33N25TM

File Size: 705212 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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FDB33N25 General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe,DMOS technology.

This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies and active power factor correction.

FDB33N25 Maximum Ratings

Symbol
Parameter
FDB33N25
Units
VDSS
Drain-Source Voltage
250
V
ID
Drain Current - Continuous (TC = 25°C)
                      - Continuous (TC  = 100°C)
33
20.4
A
A
IDM
Drain Current - Pulsed                (Note 1)
132
A
VGSS
Gate-Source Voltage
± 30
V
EAS
Single Pulsed Avalanche Energy (Note 2) 
918
mJ
IAR
Avalanche Current                      (Note 1)
33
A
EAR
Repetitive Avalanche Energy      (Note 1)                                        
23.5
mJ
dv/dt
Peak Diode Recovery dv/dt         (Note 3)
4.5
V/ns
PD
Power Dissipation (TC = 25°C)
                             - Derate above 25°C
235
1.89
W
W/°C
TJ, TSTG
Operating and Storage Temperature Range
-55 to +150
°C
TL
Maximum lead temperature for soldering purposes,1/8" from case for 5 seconds
300
°C

FDB33N25 Features

• 33A, 250V, R DS(ON)= 0.094Ω @VGS = 10 V
• Low gate charge ( typical 36.8 nC)
• Low Crss ( typical  39 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability

FDB33N25TM Parameters

Technical/Catalog InformationFDB33N25TM
VendorFairchild Semiconductor (VA)
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET PolarityN-Channel
Drain to Source Voltage (Vdss)250V
Current - Continuous Drain (Id) @ 25° C33A
Rds On (Max) @ Id, Vgs94 mOhm @ 16.5A, 10V
Input Capacitance (Ciss) @ Vds 2135pF @ 25V
Power - Max235W
PackagingCut Tape (CT)
Gate Charge (Qg) @ Vgs48nC @ 10V
Package / CaseD²Pak, SMD-220, TO-263 (2 leads + tab)
FET FeatureStandard
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names FDB33N25TM
FDB33N25TM
FDB33N25TMCT ND
FDB33N25TMCTND
FDB33N25TMCT

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