GT8G103, GT8G121, GT8G131 Selling Leads, Datasheet
MFG:TOSHIBA Package Cooled:2008+ROHS D/C:23000
GT8G103, GT8G121, GT8G131 Datasheet download
Part Number: GT8G103
MFG: TOSHIBA
Package Cooled: 2008+ROHS
D/C: 23000
MFG:TOSHIBA Package Cooled:2008+ROHS D/C:23000
GT8G103, GT8G121, GT8G131 Datasheet download
MFG: TOSHIBA
Package Cooled: 2008+ROHS
D/C: 23000
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
TOP
PDF/DataSheet Download
Datasheet: GT8G103
File Size: 230626 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: GT8G121
File Size: 233672 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: GT8G131
File Size: 217082 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
CHARACTERISTIC | SYMBOL | RATING | UNIT | |
Collector−Emitter Voltage | VCES | 400 | V | |
Gate−Emitter Voltage | DC | VGES | ±6 | V |
Pulse | VGES | ±8 | V | |
Collector Current | DC | IC | 8 | A |
1 ms | ICP | 150 | A | |
Collector Power Dissipation |
Ta = 25°C | PC | 1.3 | W |
Tc = 25°C | PC | 20 | W | |
Junction Temperature | Tj | 150 | ||
Storage Temperature Range | Tstg | −55~150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
CHARACTERISTIC | SYMBOL | RATING | UNIT | |
Collector−Emitter Voltage | VCES | 400 | V | |
Gate−Emitter Voltage | DC | VGES | ±6 | V |
Pulse | VGES | ±8 | V | |
Collector Current | DC | IC | 8 | A |
1 ms | ICP | 150 | A | |
Collector Power Dissipation |
Ta = 25°C | PC | 1.1 | W |
Tc = 25°C | PC | 20 | W | |
Junction Temperature | Tj | 150 | ||
Storage Temperature Range | Tstg | −55~150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
SYMBOL | PARAMETER | RATING | UNIT |
VCES | Collector to base voltage | 400 | V |
VGES | Collector to emitter voltageDC | ±6 | V |
VGES | Emitter to base voltagePulse | ±8 | V |
IC | Collector current DC | 8 | A |
ICP | Collector current 1 ms | 150 | A |
PC | Collector power dissipation (Note 1) | 1.1 | W |
Tj | Junction temperature | 150 | |
Tstg | Storage temperaturerange | -55 to +150 |
Note 1: Drive operation: Mount on glass epoxy board [1 inch2 * 1.5 t]
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).