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HF20ACB453215-T, HF20C120ACE, HF20D060ACE

HF20ACB453215-T, HF20C120ACE, HF20D060ACE Selling Leads, Datasheet

MFG:TDK  D/C:09+

HF20ACB453215-T, HF20C120ACE, HF20D060ACE Picture

HF20ACB453215-T, HF20C120ACE, HF20D060ACE Datasheet download

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Part Number: HF20ACB453215-T

 

MFG: TDK

Package Cooled:

D/C: 09+

 

 

 
 
 
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About HF20-12F

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Datasheet: HF20-12F

File Size: 19651 KB

Manufacturer: ASI [Advanced Semiconductor]

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About HF20C120ACE

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Datasheet: HF20C120ACE

File Size: 16467 KB

Manufacturer:

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About HF20D060ACE

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Datasheet: HF20D060ACE

File Size: 29748 KB

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HF20C120ACE General Description

The HF20C120ACE has some electrical characteristics (wafer form).When parameter is VFM,the description is forward voltage,the guaranteed (Min/Max) is 3.0V Max.,the test conditions is TJ = 25,IF = 6.0A.When parameter is BVR,the description is reverse breakdown voltage,the guaranteed (Min/Max) is 1200V Min.,the test conditions is TJ = 25,IR = 200A.When parameter is IRM,the description is reverse leakage current,the guaranteed (Min/Max) is 5A Max.,the test conditions is TJ = 25,VR = 1200V.

The HF20C120ACE has some mechanical data.The nominal back metal composition,thickness is Cr-Ni-Ag(1 KA - 4 KA - 6 KA).The nominal front metal composition,thickness is 99% Al,1% Si (3 microns).The chip dimensions is 0.130" x 0.107" .The wafer diameter is 125mm,with std.< 100 > flat.The wafer thickness is .015" ± .003".The relevant die mechanical dwg. number is 01-5165.The minimum street width is 100 microns.The reject ink dot size is 0.25 mm diameter minimum.The recommended storage environment is storage in original container, in dessicated nitrogen, with no contamination.

At present there is not too much information about this model.If you are willing to find more  about HF20C120ACE,please pay attention to our web! We will promptly update the relevant  information.



HF20C120ACE Maximum Ratings



HF20C120ACE Features



HF20D060ACE Features

• GEN3 Hexfred Technology
• Low VF
• Low IRR
• Low tRR
• Soft Reverse Recovery

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