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HF30-28S, HF30A060ACB, HF30A060ACE

HF30-28S, HF30A060ACB, HF30A060ACE Selling Leads, Datasheet

MFG:ASI  Package Cooled:380 4L  D/C:2010+

HF30-28S, HF30A060ACB, HF30A060ACE Picture

HF30-28S, HF30A060ACB, HF30A060ACE Datasheet download

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Part Number: HF30-28S

 

MFG: ASI

Package Cooled: 380 4L

D/C: 2010+

 

 

 
 
 
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  • HF30ACC321611-T

  • Vendor: TDK D/C: 11+&   Adddate: 2024-04-18
  • Inquire Now
  • orientelec   China
    Contact: Ms.Jessica Ren   MSN:jessica@orientelec.cn
    Tel: 86-10-62103873/62101821
    Fax: 86-10-62102720
    (5)

About HF30-28S

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Datasheet: HF30-28S

File Size: 18313 KB

Manufacturer: ASI [Advanced Semiconductor]

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HF30A060ACB Suppliers

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  • HF30ACC321611-T

  • Vendor: TDK D/C: 11+&   Adddate: 2024-04-18
  • Inquire Now
  • orientelec   China
    Contact: Ms.Jessica Ren   MSN:jessica@orientelec.cn
    Tel: 86-10-62103873/62101821
    Fax: 86-10-62102720
    (5)

About HF30-28F

PDF/DataSheet Download

Datasheet: HF30-28F

File Size: 18769 KB

Manufacturer: ASI [Advanced Semiconductor]

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HF30A060ACE Suppliers

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  • HF30ACC321611-T

  • Vendor: TDK D/C: 11+&   Adddate: 2024-04-18
  • Inquire Now
  • orientelec   China
    Contact: Ms.Jessica Ren   MSN:jessica@orientelec.cn
    Tel: 86-10-62103873/62101821
    Fax: 86-10-62102720
    (5)

About HF30A060ACE

PDF/DataSheet Download

Datasheet: HF30A060ACE

File Size: 15546 KB

Manufacturer:

Download : Click here to Download

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HF30A060ACE General Description

The HF30A060ACE has some electrical characteristics (wafer form).When parameter is VFM,the description is forward voltage,the guaranteed (Min/Max) is 1.7V Max.,the test conditions is TJ = 25,IF = 15.0A.When parameter is BVR,the description is reverse breakdown voltage,the guaranteed (Min/Max) is 600V Min.,the test conditions is TJ = 25,IR = 200A.When parameter is IRM,the description is reverse leakage current,the guaranteed (Min/Max) is 10A Max.,the test conditions is TJ = 25,VR = 600V.

The HF30A060ACE has some mechanical data.The nominal back metal composition,thickness is Cr-Ni-Ag(1 KA - 4 KA - 6 KA).The nominal front metal composition,thickness is 99% Al,1% Si (3 microns).The chip dimensions is 0.115" x 0.155" .The wafer diameter is 125mm,with std.< 100 > flat.The wafer thickness is .015" ± .003".The relevant die mechanical dwg. number is 01-5161.The minimum street width is 100 microns.The reject ink dot size is 0.25 mm diameter minimum.The recommended storage environment is storage in original container, in dessicated nitrogen, with no contamination.

At present there is not too much information about this model.If you are willing to find more  about HF30A060ACE,please pay attention to our web! We will promptly update the relevant  information.



HF30A060ACE Maximum Ratings



HF30A060ACE Features



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