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HF30C120ACB, HF30C120ACE, HF30D060ACE

Table of contents:
Info of HF30C120ACB
Info of HF30C120ACE
Info of HF30D060ACE

HF30C120ACB, HF30C120ACE, HF30D060ACE Selling Leads, Datasheet

MFG:IR Package Cooled:N/A D/C:2010+

HF30C120ACB, HF30C120ACE, HF30D060ACE Picture

HF30C120ACB, HF30C120ACE, HF30D060ACE Datasheet download

Five Points

Part Number: HF30C120ACB

MFG: IR

Package Cooled: N/A

D/C: 2010+

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HF30C120ACE General Description

The HF30C120ACE has some electrical characteristics (wafer form).When parameter is VFM,the description is forward voltage,the guaranteed (Min/Max) is 2.8V Max.,the test conditions is TJ = 25,IF = 4.0A.When parameter is BVR,the description is reverse breakdown voltage,the guaranteed (Min/Max) is 1200V Min.,the test conditions is TJ = 25,IR = 200A.When parameter is IRM,the description is reverse leakage current,the guaranteed (Min/Max) is 10A Max.,the test conditions is TJ = 25,VR = 1200V.

The HF30C120ACE has some mechanical data.The nominal back metal composition,thickness is Cr-Ni-Ag(1 KA - 4 KA - 6 KA).The nominal front metal composition,thickness is 99% Al,1% Si (3 microns).The chip dimensions is 0.115" x 0.155" .The wafer diameter is 125mm,with std.< 100 > flat.The wafer thickness is .015" ± .003".The relevant die mechanical dwg. number is 01-5167.The minimum street width is 100 microns.The reject ink dot size is 0.25 mm diameter minimum.The recommended storage environment is storage in original container, in dessicated nitrogen, with no contamination.

At present there is not too much information about this model.If you are willing to find more about HF30C120ACE,please pay attention to our web! We will promptly update the relevant information.

HF30C120ACE Maximum Ratings

HF30C120ACE Features

HF30D060ACE Features

• GEN3 Hexfred Technology
• Low V_F
• Low I_RR
• Low t_RR
• Soft Reverse Recovery

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