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HFA70NC60CSM, HFA70NH60, HFA70NH60R

Table of contents:
Info of HFA70NC60CSM
Info of HFA70NH60
Info of HFA70NH60R

HFA70NC60CSM, HFA70NH60, HFA70NH60R Selling Leads, Datasheet

MFG:IR Package Cooled:D61-8-SM D/C:00+

HFA70NC60CSM, HFA70NH60, HFA70NH60R Picture

HFA70NC60CSM, HFA70NH60, HFA70NH60R Datasheet download

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Part Number: HFA70NC60CSM

MFG: IR

Package Cooled: D61-8-SM

D/C: 00+

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HFA70NC60CSM General Description

HEXFREDTM diodes are optimized to reduce losses and EMI/RFI in high frequency power conditioning systems. An extensive characterization of the recovery behavior for different values of current, temperature and di/dt simplifies the calculations of losses in the operating conditions. The softness of the recovery eliminates the need for a snubber in most applications. These devices are ideally suited for power converters, motors drives and other applications where switching losses are significant portion of the total losses.

HFA70NC60CSM Maximum Ratings

	Parameter	Max.	Units
V^_R	Cathode-to-Anode Voltage	600	V
IF @ T^_C = 25°C	Continuous Forward Current	56	A
IF @ T^_C = 100°C	Continuous Forward Current	26
I^_FSM	Single Pulse Forward Current	200
E^_AS	Non-Repetitive Avalanche Energy	220	µJ
PD @ T^_C= 25°C	Maximum Power Dissipation	150	W
PD @ T^_C = 100°C	Maximum Power Dissipation	59	W
T^_J	Operating Junction and	-55 to +150	°C
T^_STG	Storage Temperature Range	-55 to +150
	Soldering Temperature, for 10 sec.	300 (0.063 in. (1.6mm) from case)

HFA70NC60CSM Features

• Reduced RFI and EMI
• Reduced Snubbing
• Extensive Characterization of Recovery Parameters

HFA70NH60R General Description

HFA70NH60R Maximum Ratings

	Parameter	Max.	Units
V^_R	Cathode-to-Anode Voltage	600	V
IF @ T^_C = 25°C	Continuous Forward Current	110	A
IF @ T^_C = 100°C	Continuous Forward Current	54
I^_FSM	Single Pulse Forward Current	400
E^_AS	Non-Repetitive Avalanche Energy	220	µJ
PD @ T^_C= 25°C	Maximum Power Dissipation	260	W
PD @ T^_C = 100°C	Maximum Power Dissipation	104	W
T^_J	Operating Junction and	-55 to +150	°C
T^_STG	Storage Temperature Range	-55 to +150
	Soldering Temperature, for 10 sec.	300 (0.063 in. (1.6mm) from case)

HFA70NH60R Features

Reduced RFI and EMI
Reduced Snubbing
Extensive Characterization of Recovery Parameters

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