HMC517, HMC517LC4, HMC518 Selling Leads, Datasheet
MFG:HITTITE Package Cooled:N/A D/C:2010+
HMC517, HMC517LC4, HMC518 Datasheet download
Part Number: HMC517
MFG: HITTITE
Package Cooled: N/A
D/C: 2010+
MFG:HITTITE Package Cooled:N/A D/C:2010+
HMC517, HMC517LC4, HMC518 Datasheet download
MFG: HITTITE
Package Cooled: N/A
D/C: 2010+
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Datasheet: HMC1001
File Size: 236544 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HMC1001
File Size: 236544 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HMC1001
File Size: 236544 KB
Manufacturer:
Download : Click here to Download
The HMC517 chip is a high dynamic range GaAs PHEMT MMIC Low Noise Amplii er (LNA) which covers the 17 to 26 GHz y range. The HMC517 provides 19 dB of small signal gain, 2.2 dB of noise i gure and has an output IP3 greater than +24 . The chip can easily be integrated into hybrid or MCM assemblies due to its small size. All datais tested with the chip in a 50 Ohm test i xture connected via 0.075mm (3 mil) ribbon bonds of minimal length 0.31 mm (12 mil). Two 0.025 mm (1 l) diameter bondwires may also be used to make the RFIN and RFOUT connections.
Drain Bias Voltage (Vdd1, Vdd2, Vdd3) | +5.5 Vdc |
RF Input Power (RFin)(Vdd = +3.0 Vdc) | +2 dBm |
Channel Temperature | 175 |
Continuous Pdiss (T= 85 ) (derate 9.8 mW/C above 85 ) |
0.88 W |
Thermal Resistance (channel to die bottom) |
102.6/W |
Storage Temperature | -65 to +150 |
Operating Temperature | -55 to +85 |
ESD Sensitivity (HBM) | Class 1A |
The HMC517LC4 chip is a high dynamic range GaAs PHEMT MMIC Low Noise Amplii er (LNA) housed in a leadless "Pb ree "RoHS compliant SMT package. ThHMC517LC4 provides 19 dB of small signal gain, 2.5 dB of noise i gure and has an put IP3 of +23 dBm. The P1dB output power of +13 dBm enables the LNA to also function as a LO driver for balanced, I/Q rimage reject mixers. The HMC517LC4 allows the use of surface mount manufacturing techniques.
Drain Bias Voltage (Vdd1, Vdd2, Vdd3 |
+5.5 Vdc |
RF Input Power (RFin)(Vdd = +3.0 Vdc) |
+2 dBm |
Channel Temperature |
175 |
Continuous Pdiss (T= 85) (derate 29 mW/ above 85) |
2.65 W |
Thermal Resistance (channel to die bottom) |
34/W |
Storage Temperature |
-65 to +150 |
Operating Temperature |
-40 to +85 |
ESD Sensitivity (HBM) |
Class 1A |
The HMC518 chip is a high dynamic range GaAs PHEMT MMIC Low Noise Amplii er (LNA) which covers the 20 to 32 GHhz frequency range. The HMC518 provides 15 dB of small signal gain, 3.0 dB of noise i gure and has an output IP3 greater than 23 dBm. The chip can easily be integrated into hybrid or MCM assemblies due to its small size. All data is tested ith the chip in a 50 Ohm test i xture connected via 0.075mm (3 mil) ribbon bonds of minimal length 0.31 mm (12 mil). o .025 mm (1 mil) diameter bondwires may also be used to make the RFIN and RFOUT connections.
Drain Bias Voltage (Vdd1, Vdd2, Vdd3) | +5.5 Vdc |
RF Input Power (RFin)(Vdd = +3.0 Vdc) | +7 dBm |
Junction Temperature | 175 |
Continuous Pdiss (T=85 ) (derate 29mW/C above 85 ) |
2.65 W |
Thermal Resistance (junction to ground paddle) |
34 /W |
Storage Temperature | -65 to +150 |
Operating Temperature | -55 to +85 |
ESD Sensitivity (HBM) | Class 1A |