HMC 1022

      The HMC 1022 is designed for Compassing;Navigation Systems;Attitude Reference;Traffic Detection;Medical Devices;Non-Contact Switch.The HMC 1022 has features including Wide Field Range;Small Package;Solid State;On-Chip Coils.HMC1022 series offers a wider field range, lower set/reset current and has a lower cost for higher volume applications.
      Configured as a 4-element wheatstone bridge, these magnetoresistive sensors convert magnetic fields to a differential output voltage, capable of sensing magnetic fields as low as 30 gauss. These MRs offer a small, low cost, high sensitivity and high reliability solution for low field magnetic sensing.Honeywell magnetoresistive sensors are simple resistive bridge devices (Figure 1) that only require a supply voltage to measure magnetic fields. When a voltage from 0 to 10 volts is connected to Vbridge, the sensor begins measuring any ambient, or applied, magnetic field in the sensitive axis. In addition to the bridge circuit, the sensor has two on-chip magnetically coupled straps-the OFFSET strap and the Set/Reset strap. These straps are patented by Honeywell and eliminate the need for external coils around the devices.Magnetoresistive sensors are made of a nickel-iron (Permalloy) thin film deposited on a silicon wafer and patterned as a resistive strip. In the presence of an applied magnetic field, a change in the bridge resistance causes a corresponding change in voltage output. An external magnetic field applied normal to the side of the film causes the magnetization vector to rotate and change angle. HMC 1022 in turn will cause the resistance value to vary (R/ R) and produce a voltage output change in the Wheatstone bridge. This change in the Permalloy resistance is termed the magnetoresistive effect and is directly related to the angle of the current flow and the magnetization vector.
      Two-axis parts of HMC 1022 contain two sensors for the x- and y- field measurements. Single-axis variations include a SIP package for mounting through the circuit board to create a 3-axis solution, a SOIC for direct surface mount, and a ceramic DIP for high performance military and high temperature applications.
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