HT6222//SM5222, HT6222-002, HT6230 Selling Leads, Datasheet
MFG:TAIWAN Package Cooled:SOP24 D/C:O2
HT6222//SM5222, HT6222-002, HT6230 Datasheet download

Part Number: HT6222//SM5222
MFG: TAIWAN
Package Cooled: SOP24
D/C: O2
MFG:TAIWAN Package Cooled:SOP24 D/C:O2
HT6222//SM5222, HT6222-002, HT6230 Datasheet download

MFG: TAIWAN
Package Cooled: SOP24
D/C: O2
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
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PDF/DataSheet Download
Datasheet: HT600
File Size: 159598 KB
Manufacturer: HOLTEK [Holtek Semiconductor Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HT600
File Size: 159598 KB
Manufacturer: HOLTEK [Holtek Semiconductor Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HT6230
File Size: 138555 KB
Manufacturer: HOLTEK [Holtek Semiconductor Inc]
Download : Click here to Download
The HT6230 is designed as infrared remote encoder, usually applied to TV systems. A total of 2048 different commands can be generated and arranged into 32 systems where each system contains 64 different commands. There are 96 keys and to each key is assigned one programmable code. The code is programmable by mask option. Legal and illegal key operation can be distinguished.
Supply Voltage..............................-0.3V to 5.5V
Input Voltage .................VSS-0.3V to VDD+0.3V
Storage Temperature.................-50 to 125
Operating Temperature ..............-25 to 75
Note: These are stress ratings only. Stresses exceeding the range specified under "Absolute Maximum Ratings" may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

