HT93LC66, HT93LC66 8 SOP, HT93LC66 8PIN DIP Selling Leads, Datasheet
MFG:HOLTEK Package Cooled:DIP-8 D/C:02+
HT93LC66, HT93LC66 8 SOP, HT93LC66 8PIN DIP Datasheet download
Part Number: HT93LC66
MFG: HOLTEK
Package Cooled: DIP-8
D/C: 02+
MFG:HOLTEK Package Cooled:DIP-8 D/C:02+
HT93LC66, HT93LC66 8 SOP, HT93LC66 8PIN DIP Datasheet download
MFG: HOLTEK
Package Cooled: DIP-8
D/C: 02+
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Datasheet: HT93LC66
File Size: 382312 KB
Manufacturer: HOLTEK [Holtek Semiconductor Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HT9011
File Size: 100623 KB
Manufacturer: HOLTEK [Holtek Semiconductor Inc]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HT9011
File Size: 100623 KB
Manufacturer: HOLTEK [Holtek Semiconductor Inc]
Download : Click here to Download
The HT93LC66 is a 4K-bit low voltage nonvolatile, serial electrically erasable programmable read only memory device using the CMOS floating gate process. Its 4096 bits of memory are organized into 256 words of 16 bits each when the ORG pin is connected to VCC or organized into 512 words of 8 bits each when it is tied to VSS. The device is optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. By popular microcontroller, the versatile serial interface including chip select (CS), serial clock (SK), data input (DI) and data output (DO) can be easily controlled。
Operation Temperature (Commercial) ......................................0°C to 70°C
Applied VCC Voltage with Respect to VSS .................................–0.3V to 6.0V
Applied Voltage on any Pin with Respect to VSS............VSS–0.3V to VCC+0.3V
Supply READ Voltage ......................................................................2V to 5.5V
Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings” may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability