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Drain to Source Voltage (Note 1)............................ VDSS 100V Drain to Gate Voltage (RGS = 20k) (Note 1) ..................... VDGR 100V Gate to Source Voltage ................................ VGS ±16 V Drain Current Continuous (TC = 25, VGS = 5V) ............................. ID10A Continuous (TC = 25, VGS = 10V) (Figure 2) ........................ID10A Continuous (TC = 100, VGS = 5V) .............................ID7A Continuous (TC = 100, VGS = 4.5V) (Figure 2) .......................ID7A Pulsed Drain Current .................................IDM Figure 4 Pulsed Avalanche Rating ...........................UIS Figures 6, 17, 18 Power Dissipation.....................................V PD49W Derate Above 25 ...................................0.327W/ Operating and Storage Temperature.....................TJ, TSTG -55 to 175 Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s .......................TL300 Package Body for 10s, See Techbrief TB334 .......................Tpkg260 NOTES: 1. TJ = 25 to 150. CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
HUFA76609D3S Features
• Ultra Low On-Resistance - r DS(ON) = 0.160, VGS = 10V - r DS(ON) = 0.165, VGS = 5V • Simulation Models - Temperature Compensated PSPICE® and SABER™Electrical Models - Spice and SABER Thermal Impedance Models - www.fairchildsemi.com • Peak Current vs Pulse Width Curve • UIS Rating Curve • Switching Time vs RGS Curves
Drain to Source Voltage (Note 1)............................ VDSS 100V Drain to Gate Voltage (RGS = 20k) (Note 1) ..................... VDGR 100V Gate to Source Voltage ................................ VGS ±16 V Drain Current Continuous (TC = 25, VGS = 5V) ............................. ID18A Continuous (TC = 25, VGS = 10V) (Figure 2) ........................ID18A Continuous (TC = 100, VGS = 5V) .............................ID12A Continuous (TC = 100, VGS = 4.5V) (Figure 2) .......................ID12A Pulsed Drain Current .................................IDM Figure 4 Pulsed Avalanche Rating ...........................UIS Figures 6, 17, 18 Power Dissipation.....................................V PD75W Derate Above 25 .....................................0.5W/ Operating and Storage Temperature.....................TJ, TSTG -55 to 175 Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s........................TL300 Package Body for 10s, See Techbrief TB334 .......................Tpkg260 NOTES: 1. TJ = 25 to 150. CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
HUFA76619D3 Features
• Ultra Low On-Resistance - r DS(ON) = 0.085, VGS = 10V - r DS(ON) = 0.087, VGS = 5V • Simulation Models - Temperature Compensated PSPICE® and SABER™Electrical Models - Spice and SABER Thermal Impedance Models - www.fairchildsemi.com • Peak Current vs Pulse Width Curve • UIS Rating Curve • Switching Time vs RGS Curves