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ThisN-Channelenhancementmodesilicongatepower?eld effect transistor is an advanced power MOSFET designed, tested, and guaranteed to withstand a speci?ed level of energyinthebreakdownavalanchemodeofoperation.Allof these power MOSFETs are designed for applications such as switching regulators, switching convertors, motor drivers, relay drivers, and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. These types can be operated directly from integrated circuits.
Formerly developmental type TA17421.
IRF140 Maximum Ratings
IRF140
UNITS
Drain to Source Voltage (Note 1)
VDS
100
V
Drain to Gate Voltage (RGS = 20k)(Note 1)
VDGR
100
V
Continuous Drain Current
ID
28
A
TC = 100
ID
20
A
Pulsed Drain Current (Note 3)
IDM
110
A
Gate to Source Voltage.
VGS
±20
V
Maximum Power Dissipation
PD
150
W
Linear Derating Factor
1.0
/W
Single Pulse Avalanche Energy Rating (Note 4)
EAS
100
mJ
Operating and Storage Temperature
TJ , TSTG
-55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from case for 10s
TL
300
Package Body for 10s, see TB334
Tpkg
260
IRF140 Features
`28A, 100V `rDS(ON)= 0.077 `Single Pulse Avalanche Energy Rated `SOA is Power-Dissipation Limited `Nanosecond Switching Speeds `Linear Transfer Characteristics `High Input Impedance `Majority Carrier Device
IRF1404 Parameters
Technical/Catalog Information
IRF1404
Vendor
International Rectifier
Category
Discrete Semiconductor Products
Mounting Type
Through Hole
FET Polarity
N-Channel
Drain to Source Voltage (Vdss)
40V
Current - Continuous Drain (Id) @ 25° C
202A
Rds On (Max) @ Id, Vgs
4 mOhm @ 121A, 10V
Input Capacitance (Ciss) @ Vds
5669pF @ 25V
Power - Max
333W
Packaging
Bulk
Gate Charge (Qg) @ Vgs
196nC @ 10V
Package / Case
TO-220-3 (Straight Leads)
FET Feature
Standard
Lead Free Status
Contains Lead
RoHS Status
RoHS Non-Compliant
Other Names
IRF1404 IRF1404
IRF1404 General Description
Seventh Generation HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliabledevice for use in a wide variety of applications.
The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.
IRF1404 Maximum Ratings
Parameter
Max.
Units
ID @ TC =25
Continuous Drain Current,VGS @ 10V
162
A
ID @ TC =100
Continuous Drain Current,VGS @ 10V
115
IDM
Pulsed Drain Current
650
PD @ TC =100
Power Dissipation
200
W
Linear Derating Factor
1.3
W/
VGS
Gate-to-Source Voltage
±20
V
EAS
Single Pulse Avalanche Energy
519
mJ
IAR
Avalanche Current
95
A
EAR
Repetitive Avalanche Energy
20
mJ
dv/dt
Peak Diode Recovery dv/dt
5.0
V/ns
TJ TSTG
Operating Junction and Storage Temperature Range
-55 to + 175 -55 to + 175
Soldering Temperature, for 10 seconds
300 (1.6mm from case)
Mounting Torque, 6-32 or screw
10 lbf.in (1.1 N.m)
IRF1404 Features
`Advanced Process Technology `Ultra Low On-Resistance `Dynamic dv/dt Rating `175 Operating Temperatur `Fast Switching `Fully Avalanche Rated