IRF150, IRF1503, IRF1503L Selling Leads, Datasheet
MFG:IR D/C:05+
MFG:IR D/C:05+
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Datasheet: IRF150
File Size: 154094 KB
Manufacturer: IRF [International Rectifier]
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PDF/DataSheet Download
Datasheet: IRF1503
File Size: 566031 KB
Manufacturer: IRF [International Rectifier]
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PDF/DataSheet Download
Datasheet: IRF034
File Size: 147521 KB
Manufacturer: IRF [International Rectifier]
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Specifically designed for Automotive applications, this design of HEXFET® Power MOSFETs utilizes the lastest processing techniques to achieve extremely low onresistance per silicon area. Additional features of this HEXFET power MOSFET are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating. These combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.
| Parameter | Max. | Units | |
| ID @ TC = 25 | Continuous Drain Current, VGS @ 10V (Silicon Limited) | 240 | A |
| ID @ TC = 100 | Continuous Drain Current, VGS @ 10V (See Fig. 9) | 170 | |
| ID @ TC = 25 | Continuous Drain Current, VGS @ 10V (Package Limited) | 75 | |
| IDM | Pulsed Drain Current | 960 | |
| ID @ TC = 25 | Power Dissipation | 330 | A |
| Linear Derating Factor | 2.2 | W/ | |
| VGS | Gate-to-Source Voltage | ±20 | V |
| EAS | Single Pulse Avalanche Energy | 510 | mJ |
| EAS (Tested ) | Single Pulse Avalanche Energy Tested Value | 980 | |
| IAR | Avalanche Current | See Fig.12a, 12b, 15, 16 | A |
| EAR | Repetitive Avalanche Energy | mJ | |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 175 | |
| Soldering Temperature, for 10 seconds | 300 (1.6mm from case ) |
Specifically designed for Automotive applications, this Stripe Planar design of HEXFET® Power MOSFETs utilizes the lastest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this HEXFET power MOSFET are a 175 junction operating temperature, fast switching speed and improved repetitive avalanche rating. These benefits combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.
| Parameter | Max. | Units | |
| ID @ TC = 25 | Continuous Drain Current, VGS @ 10V(Silicon limited) | 190 | A |
| ID @ TC = 100 | Continuous Drain Current, VGS @ 10V(See Fig.9) | 130 | |
| ID @ TC = 25 | Continuous Drain Current, VGS @ 10V (Package limited) | 75 | |
| IDM | Pulsed Drain Current | 960 | |
| PD @ TC = 25 | Power Dissipation | 200 | W |
| Linear Derating Factor | 1.3 | W/ | |
| VGS | Gate-to-Source Voltage | ±20 | V |
| EAS | Single Pulse Avalanche Energy | 510 | mJ |
| EAS (tested) | Single Pulse Avalanche Energy Tested Value | 980 | |
| IAR | Avalanche Current | See Fig.12a, 12b, 15, 16 | A |
| EAR | Repetitive Avalanche Energy | mJ | |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to 175 | |
| Soldering Temperature, for 10 seconds | 300 (1.6 mm from case) | ||
| Mounting Torque, 6-32 or M3 screw | 10 lbf•in (1.1N•m) |
