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Fifth Generation HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
IRF7207 Maximum Ratings
Parameter
Max.
Units
VDS
Drain- Source Voltage
-20
V
ID @ TC = 25
Continuous Drain Current, VGS @ 10V
-5.4
A
ID @ TC = 70
Continuous Drain Current, VGS @ 10V
-4.3
IDM
Pulsed Drain Current
-43
PD @TC = 25
Power Dissipation
2.5
W
PD @TC = 70
Power Dissipation
1.6
Linear Derating Factor
0.02
W/
VGS
Gate-to-Source Voltage
± 12
V
VGSM
Gate-to-Source Voltage Single Pulse tp<10µs
-16
V
EAS
Single Pulse Avalanche Energy
140
dv/dt
Peak Diode Recovery dv/dt
-5.0
V/ns
TJ, TSTG
Junction and Storage Temperature Range
-55 to + 150
IRF7207 Features
* Generation 5 Technology * P-Channel Mosfet * Surface Mount * Available in Tape & Reel * Dynamic dv/dt Rating * Fast Switching