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CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. TJ = 25to150.
IRFP140 Features
• 31A, 100V • rDS(ON) = 0.077 • Single Pulse Avalanche Energy Rated • SOA is Power Dissipation Limited • Nanosecond Switching Speeds • Linear Transfer Characteristics • High Input Impedance • Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
IRFP1405 General Description
Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.
IRFP1405 Maximum Ratings
Symbol
Parameter
Max.
Units
ID @ VGS = 12V, TC = 25°C
Continuous Drain Current
160
A
ID @ VGS = 12V, TC =100°C
Continuous Drain Current
110
A
IDM
Pulsed Drain Current
95
A
PD @ TV = 25
Power Dissipation
640
W
Linear Derating Factor
310
W/
VGS
Gate-to-Source Voltage
2.0
V
EAS
Single Pulse Avalanche Energy
±20
mJ
IAR
Avalanche Current
530
A
EAR
Repetitive Avalanche Energy
1060
mJ
dv/dt
Peak Diode Recovery dv/dt
See Fig.12a, 12b, 15, 16
V/ns
TJ, TSTG
Operating Junction Storage Temperature Range
-55 to 150
IRFP1405 Features
Advanced Process Technology Ultra Low On-Resistance 175°C Operating Temperature Fast Switching Repetitive Avalanche Allowed up to Tjmax
IRFP1405PBF Parameters
Technical/Catalog Information
IRFP1405PBF
Vendor
International Rectifier
Category
Discrete Semiconductor Products
Mounting Type
Through Hole
FET Polarity
N-Channel
Drain to Source Voltage (Vdss)
55V
Current - Continuous Drain (Id) @ 25° C
95A
Rds On (Max) @ Id, Vgs
5.3 mOhm @ 95A, 10V
Input Capacitance (Ciss) @ Vds
5600pF @ 25V
Power - Max
310W
Packaging
Bag
Gate Charge (Qg) @ Vgs
180nC @ 10V
Package / Case
TO-247-3 (TO-247AC, Straight Leads)
FET Feature
Standard
Drawing Number
*
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
IRFP1405PBF IRFP1405PBF
IRFP1405PBF General Description
Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.
Storage Temperature Range Soldering Temperature, for 10 seconds
300 (1.6mm from case )
Mounting torque, 6-32 or M3 srew
10 lbf•in (1.1N•m)
IRFP1405PBF Features
·Advanced Process Technology ·Ultra Low On-Resistance ·175°C Operating Temperature ·Fast Switching ·Repetitive Avalanche Allowed up to Tjmax ·Lead-Free