IRFP450LC, IRFP450LCPBF, IRFP450N Selling Leads, Datasheet
MFG:IR Package Cooled:TO-3P D/C:08+/09+
IRFP450LC, IRFP450LCPBF, IRFP450N Datasheet download

Part Number: IRFP450LC
MFG: IR
Package Cooled: TO-3P
D/C: 08+/09+
MFG:IR Package Cooled:TO-3P D/C:08+/09+
IRFP450LC, IRFP450LCPBF, IRFP450N Datasheet download

MFG: IR
Package Cooled: TO-3P
D/C: 08+/09+
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PDF/DataSheet Download
Datasheet: IRFP450LC
File Size: 348960 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: IRF034
File Size: 147521 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: IRFP450N
File Size: 123992 KB
Manufacturer:
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This new series of Low Charge HEXFET Power MOSFETs achieve significantly lower gate charge over conventional MOSFETs. Utilizing advanced Hexfet technology the device improvements allow for reduced gate drive requirements, faster switching speeds and increased total system savings. These device improvements combined with the proven ruggedness and reliability of HEXFETs offer the designer a new standard in power transistors for switching applications. The TO-247 package is preferred for commercial-industrial applications where higher power levels preclude the use of TO-220 devices. The TO-247 is similar but superior to the earlier TO-218 package because of its isolated mounting hole.
|
Parameter |
Max. |
Units | |
|
ID @ TC = 25°C |
Continuous Drain Current, V GS @ 10V |
14 |
A |
|
ID @ TC = 100°C |
Continuous Drain Current, V GS @ 10V |
8.6 | |
|
IDM |
Pulsed Drain Current |
56 | |
|
PD @TC = 25°C |
Power Dissipation |
190 |
W |
|
Linear Derating Factor |
1.5 |
W/°C | |
|
VGS |
Gate-to-Source Voltage |
±30 |
V |
|
EAS |
Single Pulse Avalanche Energy |
760 |
mJ |
|
IAR |
Avalanche Current |
14 |
A |
|
EAR |
Repetitive Avalanche Energy |
19 |
mJ |
|
dv/dt |
Peak Diode Recovery dv/dt |
3.5 |
V/ns |
|
TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 150 |
°C |
|
Soldering Temperature, for 10 seconds |
300 (1.6mm from case) | ||
|
Mounting torque, 6-32 or M3 screw. |
10 lbf•in (1.1N•m) |
|
Parameter |
Max. |
Units | |
| ID @ TC = 25°C | Continuous Drain Current, V GS @ 10V |
14 |
A |
| ID @ TC = 100°C | Continuous Drain Current, V GS @ 10V |
8.8 | |
| IDM | Pulsed Drain Current |
56 | |
| PD @TC = 25°C | Power Dissipation |
200 |
W |
| Linear Derating Factor |
1.6 |
W/°C | |
| VGS | Gate-to-Source Voltage |
±30 |
V |
| dv/dt | Peak Diode Recovery dv/dt |
5.0 |
V/ns |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55to+150 |
°C |
| Soldering Temperature, for 10 seconds |
300 (1.6mm from case) | ||
| Mounting torque, 6-32 or M3 screw. |
10 lbf`in (1.1N`m) |
