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Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low on-resistance per silicon area. Additional features of this design are a 175 junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.
IRFZ46ZSPBF Maximum Ratings
Parameter
Max.
Units
ID @ TC = 25
Continuous Drain Current, VGS @ 10V
51
A
ID @ TC = 100
Continuous Drain Current, VGS @ 10V
36
IDM
Pulsed Drain Current
200
PD @TC = 25
Maximum Power Dissipation
82
W
Linear Derating Factor
0.54
W/
VGS
Gate-to-Source Voltage
± 20
V
EAS
Single Pulse Avalanche Energy (Thermally Limited)
63
mJ
EAS (tested)
Single Pulse Avalanche Energy Tested Value
97
IAR
Avalanche Current
See Fig.12a,12b,15,16
A
EAR
Repetitive Avalanche Energy
mJ
TJ TSTG
Operating Junction and Storage Temperature Range
-55 to + 175
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
Mounting torque, 6-32 or M3 srew
10 lbf`in (1.1N`m)
IRFZ46ZSPBF Features
`Advanced Process Technology `Ultra Low On-Resistance `Dynamic dv/dt Rating `175 Operating Temperature `Fast Switching `Repetitive Avalanche Allowed up to Tjmax `Lead-Free