IRG4PC60F-P, IRG4PC60RUF, IRG4PC60S Selling Leads, Datasheet
MFG:IR Package Cooled:IGBT D/C:09+
IRG4PC60F-P, IRG4PC60RUF, IRG4PC60S Datasheet download
Part Number: IRG4PC60F-P
MFG: IR
Package Cooled: IGBT
D/C: 09+
IRG4PC60F-P, IRG4PC60RUF, IRG4PC60S
- Table of contents:
Info of IRG4PC60F-P
Info of IRG4PC60RUF
Info of IRG4PC60S
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About IRG4PC60F-P
PDF/DataSheet Download
Datasheet: IRG4PC60F-P
File Size: 121474 KB
Manufacturer:
Download : Click here to Download
About IRG4BAC50S
PDF/DataSheet Download
Datasheet: IRG4BAC50S
File Size: 138592 KB
Manufacturer:
Download : Click here to Download
About IRG4BAC50S
PDF/DataSheet Download
Datasheet: IRG4BAC50S
File Size: 138592 KB
Manufacturer:
Download : Click here to Download
IRG4PC60F-P Maximum Ratings
|
Parameter |
Max. |
Units | |
| VCES | Collector-to-Emitter Breakdown Voltage |
600 |
V |
| IC @ TC = 25°C | Continuous Collector Current |
90 |
A
|
| IC @ TC = 100°C | Continuous Collector Current |
60 | |
| ICM | Pulsed Collector Current |
120 | |
| ILM | Clamped Inductive Load Current |
120 | |
| VGE | Gate-to-Emitter Voltage |
± 20 |
V |
| EARV | Reverse Voltage Avalanche Energy |
200 |
mJ |
| PD @ TC = 25°C | Maximum Power Dissipation |
520 |
W |
| PD @ TC = 100°C | Maximum Power Dissipation |
210 | |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 150 |
°C
|
| Soldering Temperature, for 10 seconds |
300 (0.063 in. (1.6mm) from case) | ||
| Mounting torque, 6-32 or M3 screw |
10 lbf•in (1.1N•m) |
°C | |
| Maximum Reflow Temperature | 230 (Time above 183°C should not exceed 100s) |
|
Parameter |
Typ. |
Max. |
Units | |
| RJC | Junction-to-Case |
- |
0.24 |
°C/W |
| RCS | Case-to-Sink, Flat, Greased Surface |
0.24 |
- | |
| RJA | Junction-to-Ambient (Typical Socket Mount) |
- |
40 | |
| RJA | Junction-to-Ambient (PCB Mount, Steady State) |
- |
20 |
|
| Wt | Weight |
6 (0.21) |
- |
g(oz) |
IRG4PC60F-P Features
• Fast: Optimized for medium operating frequencies ( 1-5 kHz in hard switching, >20 kHz in resonant mode).
• Generation 4 IGBT design provides tighter parameter distribution and higher efficiency.
• Solder plated version of industry standard TO-247AC package.
• Generation 4 IGBT design provides tighter parameter distribution and higher efficiency.
• Solder plated version of industry standard TO-247AC package.
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