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This IGBT is specifically designed for applications in Plasma Display Panels. This device utilizes advanced trench IGBT technology to achieve low VCE(on) and low EPULSETM rating per silicon area which improve panel efficiency. Additional features are 150operating junction temperature and high repetitive peak current capability. These features combine to make this IGBT a highly efficient, robust and reliable device for PDP applications.
IRGP4065DPBF Maximum Ratings
Parameter
Max.
Units
VGE
Gate-to-Emitter Voltage
±30
V
IC@ TC = 25
Continuous Collector Current VGE @ 15V
70
A
IC@ TC = 100
Continuous Collector, VGE @15V
40
IRP @ TC = 25
Repetitive Peak Current
205
PD @ TC = 25
Power Dissipation
160
W
PD @ TC = 100
Linear Derating Factor
63
Linear Derating Factor
1.3
W/
VGS
Gate-to-Source Voltage
±30
V
dv/dt
Peak Diode Recovery dv/dt
5.0
V/ns
TJ TSTG
Operating Junction Storage Temperature Range
-40 to + 150
Soldering Temperature, for 10 seconds
300
Mounting torque, 6-32 or M3 screw
10 lbf.in (1.1N.m)
N
IRGP4065DPBF Features
· Advanced Trench IGBT Technology · Optimized for Sustain and Energy Recovery Circuits in PDP Applications · Low VCE(on) and Energy per Pulse (EPULSETM) ICfor Improved Panel Efficiency · High Repetitive Peak Current Capability · Lead Free Package