IRGP450U, IRGP450UD2, IRGP50B60PD Selling Leads, Datasheet
MFG:IR Package Cooled:TO-247 D/C:O1
IRGP450U, IRGP450UD2, IRGP50B60PD Datasheet download

Part Number: IRGP450U
MFG: IR
Package Cooled: TO-247
D/C: O1
MFG:IR Package Cooled:TO-247 D/C:O1
IRGP450U, IRGP450UD2, IRGP50B60PD Datasheet download

MFG: IR
Package Cooled: TO-247
D/C: O1
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Datasheet: IRGP450U
File Size: 109197 KB
Manufacturer:
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Datasheet: IRGP450UD2
File Size: 87297 KB
Manufacturer: IRF [International Rectifier]
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PDF/DataSheet Download
Datasheet: IRGP50B60PD
File Size: 490869 KB
Manufacturer:
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Insulated Gate Bipolar Transistors (IGBTs) from International Rectifier have higher usable current densities than comparable bipolar transistors, while at the same time having simpler gate-drive requirements of the familiar power MOSFET. They provide substantial benefits to a host of high-voltage, highcurrent applications.
|
Parameter |
Max. |
Units | |
| VCES | Collector-to-Emitter Voltage |
500 |
V |
| IC @ TC = 25°C | Continuous Collector Current |
59 |
A |
| IC @ TC = 100°C | Continuous Collector Current |
33 | |
| ICM | Pulsed Collector Current |
120 | |
| ILM | Clamped Inductive Load Current |
120 | |
| VGE | Gate-to-Emitter Voltage |
±20 |
V |
| EARV | Reverse Voltage Avalanche Energy |
20 |
mJ |
| PD @ TC = 25°C | Maximum Power Dissipation |
200 |
W |
| PD @ TC = 100°C | Maximum Power Dissipation |
78 | |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 150 |
°C
|
| Soldering Temperature, for 10 sec. |
300 (0.063 in. (1.6mm) from case) | ||
| Mounting torque, 6-32 or M3 screw. |
10 lbf`in (1.1N`m) |
Co-packaged IGBTs are a natural extension of International Rectifier's well known IGBT line. They provide the convenience of an IGBT and an ultrafast recovery diode in one package, resulting in substantial benefits to a host of high-voltage, high-current, motor control, UPS and power supply applications.
|
Parameter |
Max. |
Units | |
| VCES | Collector-to-Emitter Voltage |
500 |
V |
| IC @ TC = 25°C | Continuous Collector Current |
59 |
A |
| IC @ TC = 100°C | Continuous Collector Current |
33 | |
| ICM | Pulsed Collector Current |
120 | |
| ILM | Clamped Inductive Load Current |
120 | |
| IF @ TC = 100°C | Diode Continuous Forward Current |
29 | |
| IFM | Diode Maximum Forward Current |
120 | |
| VGE | Gate-to-Emitter Voltage |
± 20 |
V |
| PD @TC = 25°C | Maximum Power Dissipation |
200 |
W |
| PD @ TC = 100°C | Maximum Power Dissipation |
78 | |
| TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 150 |
°C |
| Soldering Temperature, for 10 sec. |
300 (0.063 in. (1.6mm) from case) | ||
| Mounting Torque, 6-32 or M3 Screw. |
10 lbf•in (1.1 N•m) |
| Parameter |
Max. |
Units | |
|
VCES |
Collector-to-Emitter Voltage |
600 |
V |
|
IC @ TC = 25°C |
Continuous Collector Current |
75 |
A |
|
IC @ TC = 100°C |
Continuous Collector Current |
42 |
A |
|
ICM |
Pulse Collector Current (Ref. Fig. C.T.4) |
150 |
A |
|
ILM |
Clamped Inductive Load Current |
150 |
A |
|
IF @ TC = 25°C |
Diode Continous Forward Current |
50 |
A |
|
IF @ TC = 100°C |
Diode Continous Forward Current |
25 |
A |
|
IFRM |
Maximum Repetitive Forward Current |
100 |
A |
|
VGE |
Gate-to-Emitter Voltage |
±20 |
V |
|
PD @ TC = 25°C |
Maximum Power Dissipation |
370 |
W |
|
PD @ TC = 100°C |
Maximum Power Dissipation |
150 |
W |
|
TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to +150 |
|
| Soldering Temperature for 10 sec. |
300 (0.063 in. (1.6mm) from case) |
| |
| Mounting Torque, 6-32 or M3 Screw |
10 lbf`in (1.1 N`m) |
