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The NAND Flash 2112 Byte/ 1056 Word Page is a family of non-volatile Flash memories that uses NAND cell technology. The NAND04GW3B2B and NAND08GW3B2A have a density of 4 Gbits and 8 Gbits, respectively. They operate from a 3V voltage supply. The size of a Page is 2112 Bytes (2048 + 64 spare).
The address lines are multiplexed with the Data Input/Output signals on a multiplexed x8 Input/Output bus. This interface reduces the pin count and makes it possible to migrate to other densities without changing the footprint.
Each block can be programmed and erased over 100,000 cycles. To extend the lifetime of NAND Flash devices it is strongly recommended to implement an Error Correction Code (ECC).
The device has hardware and software security features:
A Write Protect pin is available to give a hardware protection against program and erase operations. A Block Locking scheme is available to provide user code and/or data protection.
The device features an open-drain Ready/Busy output that can be used to identify if the Program/Erase/Read (P/E/R) Controller is currently active. The use of an open-drain output allows the Ready/Busy pins from several memories to be connected to a single pull-up resistor.
A Copy Back Program command is available to optimize the management of defective blocks. When a Page Program operation fails, the data can be programmed in another page without having to resend the data to be programmed.
The NAND04GW3B2B and NAND08GW3B2A have Cache Program and Cache Read features which improve the program and read throughputs for large files. During Cache Programming, the device loads the data in a Cache Register while the previous data is transferred to the Page Buffer and programmed into the memory array. During Cache Reading, the device loads the data in a Cache Register while the previous data is transferred to the I/O Buffers to be read.
The device has the Chip Enable Don't Care feature, which allows code to be directly downloaded by a microcontroller, as Chip Enable transitions during the latency time do not stop the read operation.
The devices have the option of a Unique Identifier (serial number), which allows each device to be uniquely identified.
The Unique Identifier options is subject to an NDA (Non Disclosure Agreement) and so not described in the datasheet. For more details of this option contact your nearest ST Sales office.
The device is available in a TSOP48 (12 x 20mm) package. In order to meet environmental requirements, ST offers the NAND04GW3B2B and NAND08GW3B2A in ECOPACK® package. ECOPACK packages are Lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
NAND04GW3B2B Maximum Ratings
Symbol
Parameter
Value
Unit
Min
Max
TBIAS
Temperature Under Bias
-50
125
°C
TSTG
Storage Temperature
-65
150
°C
VIO(1)
Input or Output Voltage
0.6
4.6
V
VDD
Supply Voltage
0.6
4.6
V
NAND04GW3B2B Features
High density NAND Flash Memory up to 8 Gbit memory array Up to 256 Mbit spare area Cost effective solution for mass storage applications NAND Interface x8 bus width Multiplexed Address/ Data Supply voltage 3.0V device: VDD = 2.7 to 3.6V Page size (2048 + 64 spare) Bytes Block size (128K + 4K spare) Bytes Page Read/Program Random access: 25s (max) Sequential access: 30ns (min) Page program time: 200s (typ) Copy Back Program mode Fast page copy without external buffering Cache Program and Cache Read modes Internal Cache Register to improve the program and read throughputs Fast Block Erase Block erase time: 2ms (typ) Status Register Electronic Signature Chip Enable 'don't care' for simple interface with microcontroller Serial Number option Data protection Hardware and Software Block Locking Hardware Program/Erase locked during Power transitions Data integrity 100,000 Program/Erase cycles 10 years Data Retention ECOPACK® package Development tools Error Correction Code software and hardware models Bad Blocks Management and Wear Leveling algorithms File System OS Native reference software Hardware simulation models