NDL80N101H2, NDM2000, NDM3000 Selling Leads, Datasheet
MFG:SVCC Package Cooled:DIP D/C:DIP
NDL80N101H2, NDM2000, NDM3000 Datasheet download
Part Number: NDL80N101H2
MFG: SVCC
Package Cooled: DIP
D/C: DIP
NDL80N101H2, NDM2000, NDM3000
- Table of contents:
Info of NDL80N101H2
Info of NDM2000
Info of NDM3000
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About NDL0505S
PDF/DataSheet Download
Datasheet: NDL0505S
File Size: 206990 KB
Manufacturer: CANDD [C&D Technologies]
Download : Click here to Download
About NDM3000
PDF/DataSheet Download
Datasheet: NDM3000
File Size: 252582 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
About NDM3000
PDF/DataSheet Download
Datasheet: NDM3000
File Size: 252582 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
NDM3000 General Description
The NDM3000 three phase brushless motor driver consists of three N-Channel and P-Channel MOSFETs in a half bridge configuration. These devices are produced using Fairchild's proprietary, high cell density DMOS technology. This very high density process is tailored to minimize on-state resistance which reduces power loss, provide superior switching performance, and withstand high energy pulses in the avalanche and commutation modes. These devices are particularly suited for low voltage 3 phase motor driver such as disk drive spindle motor control and other half bridge applications.
NDM3000 Maximum Ratings
|
Symbol |
Parameter |
NDM3000 |
Units | |
|
VDSS VGSS |
Drain-Source Voltage (All Types) Gate-Source Voltage (All Types) |
± 30 ± 20 ± 3.0 ± 10 2.5 1.6 1.4 -55 to 150 |
V V A W °C | |
|
ID |
Drain Current Q1+Q4 or Q1+Q6 or Q3+Q2 - Continuous Q3+Q6 or Q5+Q2 or Q5+Q4 Pulsed |
(Note 1a & 2) | ||
|
PD |
Total Power Dissipation Q1+Q4 or Q1+Q6 or Q3+Q2 or Q3+Q6 or Q5+Q2 or Q5+Q4 |
(Note 1a) (Note 1b) (Note 1c) | ||
| TJ,TSTG | Operating and Storage Temperature Range | |||
NDM3000 Features
· ±3.0A, ±30V, 2.5W
· High density cell design for extremely low RDS(ON).
· High power and current handling capability.
· Industry standard SOIC-16 surface mount package.
· High density cell design for extremely low RDS(ON).
· High power and current handling capability.
· Industry standard SOIC-16 surface mount package.
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