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Thermal Resistance Junction to Ambient Total Power Dissipation @ TA = 25°C Linear Derating Factor Drain Current Continuous @ TA = 25°C Continuous @ TA = 70°C Pulsed Drain Current (Note 1)
RTHJA PD ID ID IDM
40 3.13 25 5.2 4.1 26
°C/W Watts mW/°C A A A
Minimum FR4 or G10 PCB
10 seconds
Thermal Resistance Junction to Ambient Total Power Dissipation @ TA = 25°C Linear Derating Factor Drain Current Continuous @ TA = 25°C Continuous @ TA = 70°C Pulsed Drain Current (Note 1)
RTHJA PD ID ID IDM
80 1.56 12.5 3.7 2.9 19
°C/W Watts mW/°C A A A
Operating Junction and Storage Temperature
TJ,TSTG
55 to 150
°C
Single Pulse DraintoSource Avalanche Energy Starting TJ = 25°C (VDD = 30 Vdc, VGS = 10 Vdc, Peak IL = 12 Apk, L = 3.5 mH, RG = 25 )
EAS
225
mJ
1. Repetitive rating; pulse width limited by maximum junction temperature.
NTF5P03T3 Features
• Ultra Low RDS(on) • Higher Efficiency Extending Battery Life • Logic Level Gate Drive • Miniature SOT223 Surface Mount Package • Avalanche Energy Specified
NTF5P03T3 Typical Application
• DCDC Converters • Power Management • Motor Controls • Inductive Loads • Replaces MMFT5P03HD