MFG:ON Semiconductor (VA) Category:Filters Package Cooled:FLIP-CHIPCSP D/C:05+
NUF6105FCT1G, NUF6401MN, NUF6401MNT1G Datasheet download
Category: Filters
MFG: ON Semiconductor (VA)
Package Cooled: FLIP-CHIPCSP
D/C: 05+
Description: IC FILTER 6CH EMI ESD PROT 12DFN
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PDF/DataSheet Download
Datasheet: NUF2015W1
File Size: 45056 KB
Manufacturer: ON SEMICONDUCTOR
Download : Click here to Download
PDF/DataSheet Download
Datasheet: NUF6401MN
File Size: 61383 KB
Manufacturer: ON SEMICONDUCTOR
Download : Click here to Download
PDF/DataSheet Download
Datasheet: NUF2015W1
File Size: 45056 KB
Manufacturer: ON SEMICONDUCTOR
Download : Click here to Download
| Technical/Catalog Information | NUF6105FCT1G |
| Vendor | ON Semiconductor (VA) |
| Category | Filters |
| Resistance In Ohms | 100 |
| Capacitance | 27pF |
| Power (Watts) | - |
| Tolerance | - |
| Package / Case | 15-FlipChip |
| Packaging | Cut Tape (CT) |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | NUF6105FCT1G NUF6105FCT1G NUF6105FCT1GOSCT ND NUF6105FCT1GOSCTND NUF6105FCT1GOSCT |
| Technical/Catalog Information | NUF6401MNT1G |
| Vendor | ON Semiconductor (VA) |
| Category | Filters |
| Resistance In Ohms | 100 |
| Capacitance | 17pF |
| Power (Watts) | - |
| Tolerance | - |
| Package / Case | 12-DFN |
| Packaging | Cut Tape (CT) |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | NUF6401MNT1G NUF6401MNT1G NUF6401MNT1GOSCT ND NUF6401MNT1GOSCTND NUF6401MNT1GOSCT |
The NUF6401MNT1G belongs to the NUF6401MN.It is a kind of an 6 line EMI filter array for wireless applications.It offers ESD protection-clamping transients from static discharges and this protection is provided across all capacitors.It can be used in EMI filtering and ESD protection for data lines,wireless phones,PDAs and handheld products,notebook computers and LCD displays.It is available in DFN package which is Pb-free.
There are some features as follows.(1) integration of 30 discrete components; (2) compliance with IEC61000-4-2(Level 4); (3) EMI filtering and ESD protection; (4) integrated solution improves system reliability; (5) integrated solution offers cost and space savings in a DFN package; (6) reduces EMI/RFI emissions on a data line; (7)compatible footprint to BGA or flip-chip package.
What comes next is about absolute maximum ratings at Tj is 25.(1): operating temperature range(TOP) is from -40 to 85; (2): storage temperature range(TSTG) is from -55 to 150; (3): maximum lead temperature for soldering purposes(TL) is 260 at 1.8 in from case for 10 seconds; (4): maximum reverse working voltage(VRWM) is 5.0 V; (5): the typical breakdown voltage(VBR) is 7.0 V and the minimum is 6.0 V when IR is 1.0 mA; (6): the maximum leakage current(IR) is 1.0 A at the condition of VRWM is 3.0 V; (7): the typical capacitance(Cd) is 20 pF at VR is 2.5 V and f is 1.0 MHz; (8): the typical resistance(RA)is 100 ,the minimum is 85 and the maximum is 115 at IR is 20 mA.
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