RF1S30N06LESMR4365, RF1S30P05SM, RF1S30P06 Selling Leads, Datasheet
MFG:FAIR Package Cooled:TO-263 D/C:02+
RF1S30N06LESMR4365, RF1S30P05SM, RF1S30P06 Datasheet download
Part Number: RF1S30N06LESMR4365
MFG: FAIR
Package Cooled: TO-263
D/C: 02+
RF1S30N06LESMR4365, RF1S30P05SM, RF1S30P06
- Table of contents:
Info of RF1S30N06LESMR4365
Info of RF1S30P05SM
Info of RF1S30P06
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About RF1
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Datasheet: RF1
File Size: 58881 KB
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About RF1S30P05SM
PDF/DataSheet Download
Datasheet: RF1S30P05SM
File Size: 72597 KB
Manufacturer: INTERSIL [Intersil Corporation]
Download : Click here to Download
About RF1S30P06
PDF/DataSheet Download
Datasheet: RF1S30P06
File Size: 72870 KB
Manufacturer: INTERSIL [Intersil Corporation]
Download : Click here to Download
RF1S30P05SM General Description
These are P-Channel power MOSFETs manufactured using the MegaFET process. This process, which uses feature sizes approaching those of LSI circuits, gives optimum utilization of silicon, resulting in outstanding performance. They were designed for use in applications such as switching regulators, switching converters, motor drivers, and relay drivers. These transistors can be operated directly from integrated circuits.
Formerly developmental type TA09834.
RF1S30P05SM Maximum Ratings
| UNITS | |||
| Drain to Source Voltage (Note 1) | VDSS | -50 | V |
| Drain to Gate Voltage (RGS = 20kW)(Note 1) | VDGR | -50 | V |
| Gate to Source Voltage | VGS | ±20 | V |
| Continuous Drain Current | ID | 30 | A |
| Pulsed Drain Current (Note 3) (Figure 5) | IDM | Refer to Peak Current Curve | |
| Power Dissipation | PD | 120 | W |
| Linear Derating Factor | 0.8 | W/ | |
| Single Pulse Avalanche Rating (Figure 6) | EAS | Refer to UIS Curve | |
| Operating and Storage Temperature | TJ, TSTG | -55 to 175 | |
| Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. Package Body for 10s, See Techbrief 334 |
T L Tpkg |
300 260 |
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
RF1S30P05SM Features
• 30A, 50V
• r DS(ON) = 0.065W
• Temperature Compensating PSPICE® Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• 175 Operating Temperature
• Related Literature
- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
• r DS(ON) = 0.065W
• Temperature Compensating PSPICE® Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• 175 Operating Temperature
• Related Literature
- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
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