TC55329AP/35, TC55329AP-15, TC55329AP-20 Selling Leads, Datasheet
MFG:TOS Package Cooled:DIP D/C:1900
TC55329AP/35, TC55329AP-15, TC55329AP-20 Datasheet download

Part Number: TC55329AP/35
MFG: TOS
Package Cooled: DIP
D/C: 1900
MFG:TOS Package Cooled:DIP D/C:1900
TC55329AP/35, TC55329AP-15, TC55329AP-20 Datasheet download

MFG: TOS
Package Cooled: DIP
D/C: 1900
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PDF/DataSheet Download
Datasheet: TC500
File Size: 578595 KB
Manufacturer: MICROCHIP [Microchip Technology]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TC500
File Size: 578595 KB
Manufacturer: MICROCHIP [Microchip Technology]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TC500
File Size: 578595 KB
Manufacturer: MICROCHIP [Microchip Technology]
Download : Click here to Download
The TC55329AP-15 is a kind of 294,912 bit high speed CMOS static random access memory organized as 32,768 words by 9 bits and operated from a single 5 V supply. Toshiba's advanced CMOS technology and circuit design enable high speed operation. The device is suitable for use in high speed applications such as cache memory and high speed storage. It is available in a 300mil width, 32-pin DIP suitable for high density surface assembly.
There are some features as follows: (1)fast access time: 15 ns (max); (2)low power dissipation: 140 mA max when operation and 1 mA max when standby; (3)single 5 V power supply: 5 V±10%; (4)fully static operation; (5)inputs and outputs TTL compatible; (6)output buffer control: OE; (7)package: DIP32-P-300.
The following is about the maximum ratings: (1)VDD, power supply voltage: -0.5 to 7.0 V; (2)VIN, input voltage: -2.0 to 7.0 V; (3)VI/O, input/output voltage: -0.5 to VDD+0.5 V; (4)PD, power dissipation: 1.0 W; (5)TSOLDER, soldering temperature (10 sec): 260; (6)TSTG, storage temperature: -65 to +150; (7)TOPR, operating temperature: -10 to 85.
