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Commercial Operating Temperature During Read .............................. 0 to +70 During Block Erase and Word/Byte Program ............ 0 to +70 Temperature Under Bias ....... 10 to +80 Extended Operating Temperature During Read .......................... 40 to +85 During Block Erase and Word/Byte Program ........ 40 to +85 Temperature Under Bias ....... 40 to +85 Storage Temperature............65 to +125 Voltage on Any Pin (except VCC, VPP, A9 and RP#) with Respect to GND ........... 2.0 V to +7.0 V(2) Voltage on Pin RP# or Pin A9 with Respect to GND ....... 2.0 V to +13.5 V(2,3) VPP Program Voltage with Respect to GND during Block Erase and Word/Byte Program .. 2.0 V to +14.0 V(2,3) VCC Supply Voltage with Respect to GND ........... 2.0 V to +7.0 V(2) Output Short Circuit Current..............100 mA (4)
NOTES: 1. Operating temperature is for commercial product defined by this specification. 2. Minimum DC voltage is 0.5 V on input/output pins. During transitions, this level may undershoot to 2.0 V for periods <20 ns. Maximum DC voltage on input/output pins is VCC + 0.5 V which, during transitions, may overshoot to VCC + 2.0 V for periods <20 ns. 3. Maximum DC voltage on VPP may overshoot to +14.0 V for periods <20 ns. Maximum DC voltage on RP# or A9 may overshoot to 13.5 V for periods <20 ns. 4. Output shorted for no more than one second. No more than one output shorted at a time.
TE28F200CVT80 Features
` Intel SmartVoltage Technology - 5 V or 12 V Program/Erase - 3.3 V or 5 V Read Operation ` Very High-Performance Read - 5 V: 60 ns Access Time - 3 V: 110 ns Access Time ` Low Power Consumption - Max 60 mA Read Current at 5 V - Max 30 mA Read Current at 3.3 V3.6 V ` x8/x16-Selectable Input/Output Bus - 28F200 for High Performance 16- or 32-bit CPUs ` x8-Only Input/Output Architecture - 28F002B for Space-Constrained 8-bit Applications ` Optimized Array Blocking Architecture - One 16-KB Protected Boot Block - Two 8-KB Parameter Blocks - 96-KB and 128-KB Main Blocks - Top or Bottom Boot Locations ` Extended Temperature Operation - 40 °C to +85 °C `Extended Block Erase Cycling - 100,000 Cycles at Commercial Temp - 10,000 Cycles at Extended Temp ` Automated Word/Byte Program and Block Erase - Command User Interface - Status Registers - Erase Suspend Capability ` SRAM-Compatible Write Interface ` Automatic Power Savings Feature ` Reset/Deep Power-Down Input - 0.2 A ICCTypical - Provides Reset for Boot Operations ` Hardware Data Protection Feature - Absolute Hardware-Protection for Boot Block - Write Lockout during Power Transitions ` Industry-Standard Surface Mount Packaging - 40-, 48-, 56-Lead TSOP - 44-Lead PSOP ` Footprint Upgradeable to 4-Mbit and 8-Mbit Boot Block Flash Memories ` ETOX™ IV Flash Technology