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TFDU6100E, TFDU6101, TFDU6101-TR4

TFDU6100E, TFDU6101, TFDU6101-TR4 Selling Leads, Datasheet

MFG:tfk  Package Cooled:tfk  D/C:dc98

TFDU6100E, TFDU6101, TFDU6101-TR4 Picture

TFDU6100E, TFDU6101, TFDU6101-TR4 Datasheet download

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Part Number: TFDU6100E

 

MFG: tfk

Package Cooled: tfk

D/C: dc98

 

 

 
 
 
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About TFDU6100E

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Datasheet: TFDU6100E

File Size: 543731 KB

Manufacturer: VISAY [Vishay Siliconix]

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  • TFDU4100

  • Vendor: Vishay Pack: SMD D/C: 04+& Qty: 2000  Adddate: 2024-03-29
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  • Aolun Electronic co ltd   Taiwan
    Contact: Ms.Ritaho   MSN:Ao.lun@hotmail.com
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    Fax: 86-755-61327687
    (56)

About TFDU6101E

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Datasheet: TFDU6101E

File Size: 683040 KB

Manufacturer: VISAY [Vishay Siliconix]

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  • TFD50W32-B2

  • Vendor: Toshiba D/C: 10+&   Adddate: 2024-03-29
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  • TCLT Co.,LTD.   China
    Contact: Ms.BrandyHua  
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  • TFD58W40-F

  • Vendor: Toshiba D/C: 10+&   Adddate: 2024-03-29
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  • TCLT Co.,LTD.   China
    Contact: Ms.BrandyHua  
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  • TFDU4100

  • Vendor: Vishay Pack: SMD D/C: 04+& Qty: 2000  Adddate: 2024-03-29
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  • Aolun Electronic co ltd   Taiwan
    Contact: Ms.Ritaho   MSN:Ao.lun@hotmail.com
    Tel: 86-755-61358797
    Fax: 86-755-61327687
    (56)

About TFD312S

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Datasheet: TFD312S

File Size: 54478 KB

Manufacturer: SANKEN [Sanken electric]

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TFDU6100E General Description

The TFDU6100E, TFDS6500E, and TFDT6500E are a family of low-power infrared transceiver modules compliant to the IrDA 1.2 standard for fast infrared (FIR) data communication, supporting IrDA speeds up to 4.0 Mbit/s, HPSIR, Sharp ASK and carrier based remote control modes up to 2 MHz. Integrated within the transceiver modules are a photo PIN diode, infrared emitter (IRED), and a low-power CMOS control IC to provide a total frontend solution in a single package. TEMIC's FIR transceivers are available in three package options, including our BabyFace package (TFDU6100E), the smallest FIR transceiver available on the market. This wide selection provides flexibility for a variety of applications and space constraints.

The transceivers are capable of directly interfacing with a wide variety of I/O chips which perform the pulse-width modulation/demodulation function, including National Semiconductor's PC87338, PC87108 and PC87109, SMSC's FDC37C669, FDC37N769 and CAM35C44, and Hitachi's SH3. At a minimum, a current-limiting resistor in series with the infrared emitter and a VCC bypass capacitor are the only external components required to implement a complete solution.

TFDU6100E Maximum Ratings

Parameter Symbol Test Conditionsa Minb Typc Maxb Unit
Supply Voltage Range
Supply Voltage Range (Anode)
Input Currentsd
Output Sinking Current
Power Dissipatione
Junction Temperature
Ambient Temperature Range (Operating)
Storage Temperature Range
Soldering Temperature
Average Output Current
Repetitive Pulsed Output Current
IRED Anode Voltage at Current Output
Transmitter Data Input Voltage
Receiver Data Output Voltage
Virtual Source Sizef
Maximum Intensity for Class 1 Operation
of IEC 825 or EN60825g
VCC
Vanode


PD
TJ
Tamb
Tstg

IIRED (DC)
IIRED (RP)
VIREDA
VTxd
VRxd
d








See Recommended Solder Profile

<90 s, ton <20%




EN60825, 1997
0.5
0




25
25



0.5
0.5
0.5
2.5














2.8
6
VCC+1.5
10
25
350
125
85
85
240
130
600
6
VCC+0.5
VCC+0.5

320
V


mA

mW


°C


mA

V

mm
mW/sr
Notes
a. Reference point GND pin unless otherwise noted.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. Maximum input current for all pins (except IRED Anode pin).
e. See Derating Curve.
f. Method: (1-1/e) encircled energy.
g. Worst case IrDA SIR pulse pattern.

TFDU6100E Features

`Compliant to IrDA 1.2 (Up to
4 Mbit/s), HPSIR, Sharp ASK
and TV Remote
`Wide Operating Voltage Range
(2.7 to 5.5 V )
`Low-Power Consumption (3 mA
Supply Current)
`Power Shutdown Mode (1 A
Shutdown Current)
`Long Range (Up to 2.0 m at
4 Mbit/s in Nominal Design)
`High Efficiency Emitter
(120 mW/sr min ±15° )
`Three Surface Mount Package Options
Universal (9.7 x 4.7 x 4.0 mm)
Side View (13.0 x 5.95 x 5.3 mm)
Top View (13.0 x 7.6 x 5.95 mm)
`BabyFace (Universal) Package Capable of Surface Mount Solderability to Side and Top View Orientation
`Directly Interfaces With Various Super I/O and Controller Devices
`BuiltIn EMI Protection No External Shielding Necessary
`Few External Components Required
`Backward Compatible to All TEMIC SIR and FIR Infrared Transceivers

TFDU6100E Typical Application

·Notebook Computers, Desktop PCs, Palmtop Computers (Win CE, Palm PC), PDAs
·Digital Still and Video Cameras
·Printers, Fax Machines, Photocopiers, Screen Projectors
·Telecommunication Products (Cellular Phones, Pagers)
·Internet TV Boxes, Video Conferencing Systems
·External Infrared Adapters (Dongles)
·Medical and Industrial Data Collection Devices

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