TLP3023, TLP3031, TLP3041 Selling Leads, Datasheet
MFG:TOSHIBA Package Cooled:DIP-6 D/C:0244+
TLP3023, TLP3031, TLP3041 Datasheet download

Part Number: TLP3023
MFG: TOSHIBA
Package Cooled: DIP-6
D/C: 0244+
MFG:TOSHIBA Package Cooled:DIP-6 D/C:0244+
TLP3023, TLP3031, TLP3041 Datasheet download

MFG: TOSHIBA
Package Cooled: DIP-6
D/C: 0244+
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
TOP
PDF/DataSheet Download
Datasheet: TLP3023
File Size: 189065 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TLP3031(S)
File Size: 101684 KB
Manufacturer: Toshiba
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TLP3041
File Size: 312902 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
The TOSHIBA TLP3020, TLP3021, TLP3022 and TLP3023 consist of a photo-triac optically coupled to a gallium arsenide infrared emitting diode in a six lead plastic DIP package.
|
CHARACTERISTIC |
SYMBOL |
RATING |
UNIT | ||
|
LED |
Forward Current |
IF |
50 |
mA | |
| Forward Current Derating (Ta 53) |
IF/ |
−0.7 |
mA/ | ||
| Peak Forward Current (100s pulse, 100pps) |
IFP |
1 |
A | ||
| Power Dissipation |
PD |
100 |
mW | ||
| Power Dissipation Derating (Ta 25) |
PD/ |
−1.0 |
mW/ | ||
| Reverse Voltage |
VR |
5 |
V | ||
| Junction Temperature |
Tj |
125 |
|||
|
DETECTOR |
Off-State Output Terminal Voltage |
VDRM |
400 |
V | |
| On-Stage RMS | Ta=25 |
IT(RMS) |
100 |
mA | |
| Current | Ta=70 |
50 | |||
| On-State Current Derating (Ta 25) |
IT/ |
−1.1 |
mA/ | ||
| Peak On-Stage Current (100s pulse, 120pps) |
ITP |
2 |
A | ||
| Peak Nonrepetitive Surge Current (PW=10ms, DC=10%) |
ITSM |
1.2 |
A | ||
| Power Dissipation |
PD |
300 |
mW | ||
| Power Dissipation Derating (Ta 25) |
PD/ |
−4.0 |
mW/ | ||
| Junction Temperature |
Tj |
115 |
|||
| Storage Temperature Range |
Tstg |
−55 ~ 150 |
|||
| Operating Temperature Range |
Topr |
−40 ~ 100 |
|||
| Lead Soldering Temperature (10s) |
Tsol |
260 |
|||
| Total Package Power Dissipation |
PT |
330 |
mW | ||
| Total Package Power Dissipation Derating (Ta 25) |
PT/ |
−4.4 |
mW/ | ||
| Isolation Voltage (AC, 1 min., R.H. 60%) (Note 1) |
BVS |
5000 |
Vrms | ||
Note 1: Device considered a two terminal device :Pins 1, 2 and 3 shorted together and pins 4 and 6 shorted together.
Peak Off-State Voltage : 400 V (Min.)
Trigger LED Current : 30mA (Max.) (TLP3020)
15 mA (Max.) (TLP3021)
10 mA (Max.) (TLP3022)
5 mA (Max.) (TLP3023)
On-State Current : 100 mA (Max.)
UL Recognized : UL1577, File No. E67349
Isolation Voltage : 5000 Vrms (Min.)
Option (D4) Type
VDE Approved : DIN VDE0884 / 08.87,
Certificate No. 68329
Maximum Operating Insulation Voltage: 630 VPK
Highest Permissible Over Voltage: 6000 VPK
Note: When a VDE0884 approved type is needed, please designate the " Option (D4) "
7.62mm pich 10.16 mm pich
standard type (LF2) type
Creepage Distance : 7.0 mm (Min.) 8.0 mm (Min.)
Clearance : 7.0 mm (Min.) 8.0 mm (Min.)
Insulation Thickness : 0.5 mm (Min.) 0.5 mm (Min.)
|
CHARACTERISTIC |
SYMBOL |
RATING |
UNIT | ||
|
LED |
Forward Current |
IF |
50 |
mA | |
| Forward Current Derating (Ta 53) |
IF/ |
−0.7 |
mA/ | ||
| Peak Forward Current (100s pulse, 100pps) |
IFP |
1 |
A | ||
| Power Dissipation |
PD |
100 |
mW | ||
| Power Dissipation Derating (Ta 25) |
PD/ |
−1.0 |
mW/ | ||
| Reverse Voltage |
VR |
5 |
V | ||
| Junction Temperature |
Tj |
125 |
|||
|
DETECTOR |
Off-State Output Terminal Voltage |
VDRM |
400 |
V | |
| On-Stage RMS | Ta=25 |
IT(RMS) |
100 |
mA | |
| Current | Ta=70 |
50 | |||
| On-State Current Derating (Ta 25) |
IT/ |
−1.1 |
mA/ | ||
| Peak On-Stage Current (100s pulse, 120pps) |
ITP |
2 |
A | ||
| Peak Nonrepetitive Surge Current (PW=10ms, DC=10%) |
ITSM |
1.2 |
A | ||
| Power Dissipation |
PD |
300 |
mW | ||
| Power Dissipation Derating (Ta 25) |
PD/ |
−4.0 |
mW/ | ||
| Junction Temperature |
Tj |
115 |
|||
| Storage Temperature Range |
Tstg |
−55 ~ 150 |
|||
| Operating Temperature Range |
Topr |
−40 ~ 100 |
|||
| Lead Soldering Temperature (10s) |
Tsol |
260 |
|||
| Total Package Power Dissipation |
PT |
330 |
mW | ||
| Total Package Power Dissipation Derating (Ta 25) |
PT/ |
−4.4 |
mW/ | ||
| Isolation Voltage (AC, 1 min., R.H. 60%) (Note 1) |
BVS |
5000 |
Vrms | ||

