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TLRE1002A, TLRE1005B, TLRE1008A

Table of contents:
Info of TLRE1002A
Info of TLRE1005B
Info of TLRE1008A

TLRE1002A, TLRE1005B, TLRE1008A Selling Leads, Datasheet

MFG:TOSHIBA Package Cooled:0805LED D/C:07+

TLRE1002A, TLRE1005B, TLRE1008A Datasheet download

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Part Number: TLRE1002A

MFG: TOSHIBA

Package Cooled: 0805LED

D/C: 07+

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TLRE1002A Maximum Ratings

Opto-Electrical Characteristics (Ta=25°C) Characteristics Symbol Test Condition Min Typ Max Unit Forward Voltage V_F IF=20mA - 1.90
2.40
V Reverse Current I_R VR=4V - - 50
μA Luminous Intensity I_V IF=20mA 27
70
- mcd Viewing Angle 2q1/2 - - 120° - deg Peak Wavelength lpeak IF=20mA - 644
- nm Dominant Wavelength lD IF=20mA - 630
- nm Spectral Line Half-Width Dl1/2 IF=20mA - 18
- nm

TLRE1002A Features

• Surface-mount devices
• 2.0 (L) × 1.25 (W) × 1.1 (H) mm
• InGaAℓP LEDs
• It can be manufactured high-luminosity of equipment or reduce of electric power consumption by change in the high-luminosity
   LED from general-luminosity one.
• Colors: red, orange, yellow, pure yellow, green, pure green
• Pb-free reflow soldering is possible
• Applications:
   Backlighting source for battery-powered equipment
   Pilot light for compact equipment
   Low-power electronic equipment, etc.
• Standard embossed tape packing: T02 (3000/reel)
                                                          8-mm tape reel

TLRE1005B Maximum Ratings

Characteristic	Symbol	Max	Unit
Forward Current	I_F	25	mA
Reverse Voltage	V_R	4.00	V
Power Dissipation	P_D	60.00	mW
Operating Temperature	T_opr	-40 ~ 85
Storage Temperature	T_stg	-40 ~ 100
Soldering Temperature	Tsol	260
Soldering Time	-	for 3 sec. max	-

TLRE1005B Features

·3.2 (L) x 2.4 (W) x 2.4 (H) mm
·2 mm lens top type
·InGaAlP LED
·Reflow soldering is possible
·Standard embossed taping 4 mm pitch : T03 (1000 pcs/reel)

TLRE1005B Typical Application

· High−output backlighting source
· Battery−powered equipment
· Message boards
· Portable devices
· Computer peripherals

TLRE1008A General Description

The TLRE1008A is a panel circuit indicator.TOSHIBA is continually working to improve the quality and the reliability of its products. Nevertheless,semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress.

The TLRE1008A has the following features including:(1)it can be manufactured high-luminosity of equipment or reduce of electric power consumption by change in the high-luminosity LED from general-luminosity one; (2)colors:red, orange, yellow, green, pure green; (3)since the products are only 0.6 mm thick, they are suitable for use in thin equipment; (4)incorporates opaque diffusing resin; (5)good light diffusion-ideal for backlighting; (6)can be mounted using surface mounter; (7)reflow soldering is possible.Toshiba is continually working to improve the quality and the reliability of their products.Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and their vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Toshiba products, to observe standards of safety, and to avoid situations in which the malfunction or failure of a Toshiba product could cause loss of human life, bodily injury or damage to property.

The absolute maximum ratings of the TLRE1008A are:(1)storage temperature:-40 to 100; (2)operating temperature:-40 to 85; (3)reverse voltage:4V; (4)forward current:25A;(5)power disspation:60W.The maximum ratings are the limit values which must not be exceeded during operation of device. None of these rating value must not be exceeded. If the maximum rating value is exceeded, the characteristics of devices may never be restored properly. In extreme cases, the device may be permanently damages.Some optical modules come with a protective cap.The protective cap is used to avoid malfunction when the optical module is not in use. Note that it is not dust or waterproof.As mentioned before, optical modules are optical components. Thus, in principle,soldering where there may be flux residue and flux removal after soldering is not recommended.Toshiba recommend that soldering be performed without the optical module mounted on the board.Then, after the board has been cleaned, the optical module should be soldered on to the board manually.

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