TSSP4400, TSSP4500, TSSS2600 Selling Leads, Datasheet
MFG:tfk Package Cooled:tfk D/C:dc95
TSSP4400, TSSP4500, TSSS2600 Datasheet download

Part Number: TSSP4400
MFG: tfk
Package Cooled: tfk
D/C: dc95
MFG:tfk Package Cooled:tfk D/C:dc95
TSSP4400, TSSP4500, TSSS2600 Datasheet download

MFG: tfk
Package Cooled: tfk
D/C: dc95
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PDF/DataSheet Download
Datasheet: TSS10G45S
File Size: 219358 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TSS10G45S
File Size: 219358 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TSSS2600
File Size: 100990 KB
Manufacturer: VISAY [Vishay Siliconix]
Download : Click here to Download
TSSP4400 is a high intensity infrared emitting diode in GaAlAs on GaAs technology, molded in a clear, blue grey tinted plastic package with spherical side view lens. The device is spectrally matched to silicon photodiodes and phototransistors.
|
Parameter |
Test Conditionsc |
Symbol |
Value |
Unit |
|
Reverse Voltage |
VR |
5 |
V | |
|
Forward Current |
IF |
100 |
mA | |
|
Peak Forward Current |
tp/T=0.5, tp=100s |
IFM |
200 |
mA |
|
Surge Forward Current |
tp=100s |
IFSM |
2.0 |
A |
|
Power Dissipation |
PV |
170 |
mW | |
|
Junction Temperature |
Tj |
100 |
||
|
Operating Temperature Range |
Tamb |
55...+100 |
||
|
Storage Temperature Range |
Tstg |
55...+100 |
||
|
Soldering Temperature |
t5sec, 2 mm from case |
Tsd |
260 |
|
|
Thermal Resistance Junction/Ambient |
RthJA |
450 |
K/W |
High power infrared emitter in light curtains, light barriers, transmissive or reflective sensors in combination with PIN photodiodes or phototransistors.
Infrared remote control and free air transmission systems for long transmission distance and medium wide angle requirements in combination with PIN photo diodes or photo modules. Suitable as replacement of CQX47.
| Parameter | Test Conditions | Symbol | Value | Unit |
| Reverse Voltage | VR | 5 | V | |
| Forward Current | IF | 100 | mA | |
| Peak Forward Current | tp/T = 0.5, tp = 100 s | IFM | 200 | mA |
| Surge Forward Current | tp = 100 s | IFSM | 2 | A |
| Power Dissipation | PV | 170 | mW | |
| Junction Temperature | Tj | 100 | ||
| Operating Temperature Range | Tamb | 55...+100 | ||
| Storage Temperature Range | Tstg | 55...+100 | ||
| Soldering Temperature | t 5sec, 2 mm from case | Tsd | 260 | |
| Thermal Resistance Junction/Ambient | RthJA | 450 | K/W |
