US2M-13-F, US2MA, US2MA-13-F Selling Leads, Datasheet
MFG:DO-214AA Package Cooled:DIODES D/C:07+
US2M-13-F, US2MA, US2MA-13-F Datasheet download
Part Number: US2M-13-F
MFG: DO-214AA
Package Cooled: DIODES
D/C: 07+
US2M-13-F, US2MA, US2MA-13-F
- Table of contents:
Info of US2M-13-F
Info of US2MA
Info of US2MA-13-F
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About US20
PDF/DataSheet Download
Datasheet: US20
File Size: 157326 KB
Manufacturer: MICROSEMI [Microsemi Corporation]
Download : Click here to Download
About US2MA
PDF/DataSheet Download
Datasheet: US2MA
File Size: 17527 KB
Manufacturer: SSE [Shanghai Sunrise Electronics]
Download : Click here to Download
About US20
PDF/DataSheet Download
Datasheet: US20
File Size: 157326 KB
Manufacturer: MICROSEMI [Microsemi Corporation]
Download : Click here to Download
US2MA Maximum Ratings
| Characteristic |
SYMBOLS |
US2 AB |
US1 BB |
US2 DB |
US2 GB |
US2 JB |
US2 KB |
US2 MB |
UNITS |
| Maximum Repetitive Peak Reverse Voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 |
V |
| Maximum RMS Voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
700 |
V |
| Maximum DC Blocking Voltage | VDC | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Average Rectified Output Current @TL = 90°C |
IF(AV) |
2.0 |
A | ||||||
| Peak Forward Surge Current (8.3ms single half sine-wave superimposed on rated load) |
IFSM |
50 |
A | ||||||
| Maximum Instantaneous Forward Voltage (at rated forward current) |
VF |
1.0 |
1.4 |
1.7 |
V | ||||
| Peak Reverse Current @TA = 25°C At Rated DC Blocking Voltage @TA = 100°C |
IR |
5.0 350 |
A | ||||||
| Reverse Recovery Time (Note 1) |
trr |
50 |
75 |
nS | |||||
| Typical Junction Capacitance (Note 2) |
Cj |
25 |
25 |
pF | |||||
| Typical Thermal Resistance (Note 3) |
RJL |
20 |
oC/W | ||||||
| Operating and storage temperature range |
TJ, TSTG |
-50 to +150 |
°C | ||||||
1.Reverse recovery condition IF=0.5A, IR=1.0A,Irr=0.25A.
2.Measured at 1.0 MHz and applied voltage of 4.0Vdc
3.Thermal resistance from junction to terminal mounted on 5*5mm copper pad area
US2MA Features
• Ideal for surface mount pick and place application
• Low profile package
• Built-in strain relief
• High surge capability
• Glass passivated chip
• Ultra fast recovery for high efficiency
• High temperature soldering guaranteed: 260oC/10sec/at terminal
• Low profile package
• Built-in strain relief
• High surge capability
• Glass passivated chip
• Ultra fast recovery for high efficiency
• High temperature soldering guaranteed: 260oC/10sec/at terminal
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