Industry News (2011/10/21)
Index
The Development of Through-silicon via Technology will Benefit the Entire Industry
Published:2011/10/21 1:39:00 Author:Li xiao na
When the system-on-chip semiconductor device becomes more and more complicated, the designers are seeking the practically of 3D chips. Although the 3D chips can be taken with different kinds of forms, the through-silicon via (TSV) is the best choice, because it allows die to be staked on top of one another. Memory is the common e... (View)
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Agilent, Datang Develop TD-LTE-Advanced Together
Published:2011/10/21 1:30:00 Author:Amy
It is reported that in order to develop new technologies and test standards to promote TD-LTE-Advanced technologies, Agilent Technologies Inc and Datang Telecom Group work together to build a TD-LTE-Advanced Joint Research Lab. Datang Telecom (Beijing, China) is the owner of core patents and a leader in the telecom equipment market, and also is the initiator of the TD-SCDMA international 3G mobile communic... (View)
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