Published:2012/4/19 22:47:00 Author:Li xiao na
PCB is the substrate that can be used to assemble electronic components. It can make the electronic components connect according to the scheduled circuit. It is called “mother of the electronic devices”. PCB was invented 1936; It... (View)
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Published:2012/4/19 21:14:00 Author:Ecco
The new PE9915x POL DC-DC synchronous buck regulators are developed to replace traditional multi-chip modules such as power FPGAs, DSPs, ASICs, and SRAMs. The new power management is designed to be smallest space-grade monolithic non-isolated distributed po... (View)
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Published:2012/4/19 4:14:00 Author:Li xiao na
Nowadays, the hot spot of semiconductor market is transferring from CPU to AP all over the world. The Snapdragon、Exynos、OMAP are leading the processor market, and Samsung has taken the largest market share. How will the industry structure change in the future? With the growing sales of intelligent device, the application pr... (View)
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Published:2012/4/19 3:49:00 Author:Ecco
We’ll be unpacking boxes of old iPods and iPhones and setting them out for kids to tear apart in less than two weeks. That’s one of the fun activities planned for the Innovation Generation (iGEN... (View)
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Published:2012/4/19 3:17:00 Author:Ecco
Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) will offer only one process at the 20-nm node. That will be a change from the multiple processes that the foundry giant has offered customers for the past several nodes. Shang-yi Chiang is the executive vice president and co-chief operating officer at TSMC. He said the firm might also offer an 18- or 16-nm process node after 20-nm if lithography technology... (View)
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