CSPEMI608G-LGE, CSPEMI704, CSPESD301 Selling Leads, Datasheet
MFG:CMD Package Cooled:CSP-20 D/C:09+
CSPEMI608G-LGE, CSPEMI704, CSPESD301 Datasheet download
Part Number: CSPEMI608G-LGE
MFG: CMD
Package Cooled: CSP-20
D/C: 09+
CSPEMI608G-LGE, CSPEMI704, CSPESD301
- Table of contents:
Info of CSPEMI608G-LGE
Info of CSPEMI704
Info of CSPESD301
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About CSP1027
PDF/DataSheet Download
Datasheet: CSP1027
File Size: 960125 KB
Manufacturer: AGERE [Agere Systems]
Download : Click here to Download
About CSP1027
PDF/DataSheet Download
Datasheet: CSP1027
File Size: 960125 KB
Manufacturer: AGERE [Agere Systems]
Download : Click here to Download
About CSPESD301
PDF/DataSheet Download
Datasheet: CSPESD301
File Size: 441116 KB
Manufacturer: CALMIRCO [California Micro Devices Corp]
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CSPESD301 General Description
The CSPESD301/302/303 is a family of 1, 2, and 3- channel ESD protection arrays, which integrate two, three and four identical avalanche-style diodes. It is intended that one of these diodes is connected to GND and the other diodes provide ESD protection for up to 3 lines depending upon the configuration utilized. The back-to-back diode connections provide ESD protection for nodes that have AC signals up to 5.9V peak. These devices provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The diodes are designed and characterized to safely dissipate ESD strikes of ±15kV, well beyond the maximum requirements of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, these devices protection against contact discharges at greater than ±30kV. The diodes also provide some EMI filtering, when used in combination with a PCB trace or series resistor.
These devices are particularly well suited for portable electronics (e.g. cellular telephones, PDAs, notebook computers) because of their small package format and easy-to-use pin assignments.
The CSPESD301/2/3 is available in a space-saving, low-profile, chip-scale package with optional lead-free finishing.
These devices are particularly well suited for portable electronics (e.g. cellular telephones, PDAs, notebook computers) because of their small package format and easy-to-use pin assignments.
The CSPESD301/2/3 is available in a space-saving, low-profile, chip-scale package with optional lead-free finishing.
CSPESD301 Maximum Ratings
| PARAMETER |
RATING |
UNITS |
| Storage Temperature Range |
-65 to +150 |
°C |
| DC Package Power Rating |
200 |
mW |
CSPESD301 Features
• 1, 2 or 3 channels of ESD protection
• ±15kV ESD protection (IEC 61000-4-2, contact discharge)
• ±30kV ESD protection (HBM)
• Supports both AC and DC signal applications
• Low leakage current (<100nA)
• Chip Scale Package features extremely low lead inductance for optimum ESD and filter performance
• 4 bump, 1.06 x 0.93mm footprint Chip Scale Package (CSP)
• Lead-free version available
• ±15kV ESD protection (IEC 61000-4-2, contact discharge)
• ±30kV ESD protection (HBM)
• Supports both AC and DC signal applications
• Low leakage current (<100nA)
• Chip Scale Package features extremely low lead inductance for optimum ESD and filter performance
• 4 bump, 1.06 x 0.93mm footprint Chip Scale Package (CSP)
• Lead-free version available
CSPESD301 Typical Application
• I/O port protection
• EMI filtering for data ports
• Cellphones, notebook computers, PDAs
• Wireless Handsets
• MP3 Players
• Digital Still Cameras
• Handheld PCs
• EMI filtering for data ports
• Cellphones, notebook computers, PDAs
• Wireless Handsets
• MP3 Players
• Digital Still Cameras
• Handheld PCs
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