CSPDDR100

Features:

• 16 Integrated High frequency Series/Parallel Terminations
• Ultra small footprint Chip Scale Package
• Ceramic substrate
• 0.35mm Eutectic Solder Bumps, 0.65mm Pitch


Application

• DDR Memory bus termination
• SSTL Termination


Description

The CSPDDR100 is a high performance Integrated Passive Device (IPD) which provides Series/Parallel terminations suitable for use in SSTL and DDR termination applications. Sixteen (16) Series/Parallel termination channels are provided for a total of 32 integrated resistors.

These resistors CSPDDR100 provide excellent high frequency performance in excess of 3GHz and are manufactured to an absolute tolerance of ±1%.

CSPDDR100 Scale Package provides an ultra small footprint for this Integrated Passive Device and provides minimal parasitics compared to conventional packaging. Typical bump inductance is less than 25pH.

The large solder bumps and ceramic substrate allow for standard attachment to laminate printed circuit boards without the use of underfill. The 4X9 Bump pattern is arranged for easy flow through routing on the pcb.