CSPRC032, CSPRC032A, CSPRC032AG Selling Leads, Datasheet
MFG:N/A Package Cooled:1206 D/C:09+
CSPRC032, CSPRC032A, CSPRC032AG Datasheet download
Part Number: CSPRC032
MFG: N/A
Package Cooled: 1206
D/C: 09+
CSPRC032, CSPRC032A, CSPRC032AG
- Table of contents:
Info of CSPRC032
Info of CSPRC032A
Info of CSPRC032AG
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About CSPRC032
PDF/DataSheet Download
Datasheet: CSPRC032
File Size: 45529 KB
Manufacturer: CALMIRCO [California Micro Devices Corp]
Download : Click here to Download
About CSPRC032A
PDF/DataSheet Download
Datasheet: CSPRC032A
File Size: 552891 KB
Manufacturer:
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About CSP1027
PDF/DataSheet Download
Datasheet: CSP1027
File Size: 960125 KB
Manufacturer: AGERE [Agere Systems]
Download : Click here to Download
CSPRC032 General Description
Many portable applications frequently demand filtering of signals in the 800-2,700 MHz band. California Micro Devices' unique thin film Flip Chip filters provide a minimum of 30 dB of attenuation over this frequency band.
The bump size and pitch of these filters are selected such that the device can be placed directly on a FR4 printed circuit board using conventional assembly techniques. The pin-out for the device features a signal 'flow through' design, allowing optimal signal routing. Ground-bounce and cross-talk are minimized via a die design that provides two solder bump contacts to the common supply connection.
The solder bump contacts are a 63/37 Sn/Pb alloy and are nominally 0.35 mm in diameter.
The bump size and pitch of these filters are selected such that the device can be placed directly on a FR4 printed circuit board using conventional assembly techniques. The pin-out for the device features a signal 'flow through' design, allowing optimal signal routing. Ground-bounce and cross-talk are minimized via a die design that provides two solder bump contacts to the common supply connection.
The solder bump contacts are a 63/37 Sn/Pb alloy and are nominally 0.35 mm in diameter.
CSPRC032 Features
• Minimal Cross-Talk
• 4 Filter lines per device
• Ultra small foot print
• Silicon substrate
• 0.35mm Eutectic Solder Bumps
• 4 Filter lines per device
• Ultra small foot print
• Silicon substrate
• 0.35mm Eutectic Solder Bumps
CSPRC032 Typical Application
• Cellular Phones
• Cordless Phones
• Internet Appliances
• PDAs
• Laptop Computers
• Cordless Phones
• Internet Appliances
• PDAs
• Laptop Computers
CSPRC032A General Description
The CSPRC032A is a 4-channel low pass EMI filter (R-C-R configuration) in a Chip Scale Package (CSP). Many portable applications require the attenuation of signals in the 800-3000 MHz band. California Micro Devices&prime unique thin film technology provides a minimum of -25dB of attenuation over this frequency band.
The bump size and pitch of these filters are selected such that the device can be placed directly on a FR4 printed circuit board using conventional assembly techniques. The pin-out for the device features a signal
"flow through" design, allowing optimal signal routing. The solder bump contacts are a 63/37 Sn/Pb alloy (Sn/Ag/Cu for lead-free finish) and are 0.30 mm in diameter.
The CSPRC032A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing.
CSPRC032A Maximum Ratings
- 4 EMI filter lines per device
- Filters attenuate to -30dB at 3GHz
- CSP package minimizes cross-talk
- 9-bump 2.485mm X 0.985mm Chip Scale
- Package (CSP), 0.5mm pitch
- 0.30mm Eutectic solder bumps
- Ultra small foot print suitable for portable devices
- Lead-free version available
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