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This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low rDS(ON) and fast switching speed.
Thermal Resistance Junction to Case TO-252 Thermal Resistance Junction to Ambient TO-252 Thermal Resistance Junction to Ambient TO-252, 1in2 copper pad area
2.73 100 52
°C/W °C/W °C/W
FDU8882 Features
·rDS(ON) = 11.5mΩ, VGS = 10V, ID = 35A ·rDS(ON) = 15mΩ, VGS = 4.5V, ID = 35A ·High performance trench technology for extremely low rDS(ON) ·Low gate charge ·High power and current handling capability
FDU8882 Typical Application
·DC/DC converters
FDU8896 Parameters
Technical/Catalog Information
FDU8896
Vendor
Fairchild Semiconductor
Category
Discrete Semiconductor Products
Mounting Type
Through Hole
FET Polarity
N-Channel
Drain to Source Voltage (Vdss)
30V
Current - Continuous Drain (Id) @ 25° C
94A
Rds On (Max) @ Id, Vgs
5.7 mOhm @ 35A, 10V
Input Capacitance (Ciss) @ Vds
2525pF @ 15V
Power - Max
80W
Packaging
Tube
Gate Charge (Qg) @ Vgs
60nC @ 10V
Package / Case
IPak, TO-251, DPak, VPak (3 straight leads + tab)
FET Feature
Logic Level Gate
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
FDU8896 FDU8896
FDU8896 General Description
The FDU8896 is a N-channel PowerTrench® MOSFET.It has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers.It has been optimized for low gate charge, lowrDS(ON) and fast switching speed.It can be used as DC/DC converters and its package is I-PAK.
There are some information about the features.(1)high performance trench technology for extremely low rDS(rDS(ON) is 5.7 m, VGS is 10 V, ID is 35 A)(ON);(2)low gate charge;(3)high power and current handling capability.
The following is its maximum ratings at TC is 25.(1):drain to source voltage(VDSS) is 30 V;(2):gate to source voltage(VGS) is ±20 V;(3):drain current is 94 A when VGS is 10 V;(4):single pulse avalanche energy(EAS) is 168 mJ;(5):derate above 25 is 0.53 W/;(6):both operating and storage temperature are from -55 to 175.(7):the minimum of drain to source breakdown voltage(BVDSS) is 30 V at the condition of ID is 250 mA, VGS is 0 V;(8):gate to source leakage current(IGSS) is ±100 nA at VGS is ±20 V(9):the typical input capacitance(CISS) is 2525 pF at VDS is 15 V,VGS is 0 V,f is 1 MHz;(10):the typical rise time is106 ns at VDD is 15 V,ID is 35 A,VGS is 10 V and RGS is 6.2 W.