G2995, G2996, G2996F1U Selling Leads, Datasheet
MFG:53 Package Cooled:GMT D/C:06+
G2995, G2996, G2996F1U
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Info of G2995
Info of G2996
Info of G2996F1U
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About G2995
PDF/DataSheet Download
Datasheet: G2995
File Size: 279167 KB
Manufacturer: GMT [Global Mixed-mode Technology Inc]
Download : Click here to Download
About G2995
PDF/DataSheet Download
Datasheet: G2995
File Size: 279167 KB
Manufacturer: GMT [Global Mixed-mode Technology Inc]
Download : Click here to Download
About G2995
PDF/DataSheet Download
Datasheet: G2995
File Size: 279167 KB
Manufacturer: GMT [Global Mixed-mode Technology Inc]
Download : Click here to Download
G2995 General Description
The G2995 is a linear regulator designed to meet the JEDEC SSTL-2 and SSTL-3 (Series Stub Termination Logic) specifications for termination of DDR-SDRAM. It contains a high-speed operational amplifier that provides excellent response to the load transients. This device can deliver 1.5A continuous current and transient peaks up to 3A in the application as required for DDR-SDRAM termination. With an independent VSENSE pin, the G2995 can provide superior load regulation. The G2995 provides a VREF output as the reference for the applications of the chipset and DIMMs.
The G2995 can easily provide the accurate VTT and VREF voltages without external resistors that PCB areas can be reduced. The quiescent current is as low as 280µA @ 2.5V. So the power consumption can meet the low power consumption applications.
G2995 Maximum Ratings
Supply Voltage
PVIN, AVIN, VDDQ to GND............................-0.3V to +6V
Operating Ambient Temperature Range
TA............................................................-40 to +125
Maximum Junction Temperature, TJ.........................150
Storage Temperature Range, TSTG...........-65 to+150
Reflow Temperature (Soldering, 10 sec).................260
Electrostatic Discharge, VESD
Human body mode............................................2000V(2)
SOP-8L Thermal Resistance (JA).......................130/W
SOP-8L (FD) Thermal Resistance (JA)..............50/W(3)
SOP-8L (FD) Thermal Resistance (JA)..............41/W(4)
SOP-8L (FD) Thermal Resistance (Jc)...................12/W
Operating Ambient Temperature Range
TA................................................................40 to +85
AVIN to GND................................................1.6V to +5.5V
PVIN, VDDQ to GND.......................................1.6V to AVIN
Note:
(1) : Absolute maximum rating indicates limits beyond which damage to the
device may occurs.
(2) : Human body model : C = 100pF, R = 1500, 3 positive pulses plus
3 negative pulses
(3) : The package is placed on a 2-layer PCB (2oz/2oz) with 6 vias.
(4) : The package is placed on a 2-layer PCB (2oz/2oz) with 6 vias. The airflow
is used.
PVIN, AVIN, VDDQ to GND............................-0.3V to +6V
Operating Ambient Temperature Range
TA............................................................-40 to +125
Maximum Junction Temperature, TJ.........................150
Storage Temperature Range, TSTG...........-65 to+150
Reflow Temperature (Soldering, 10 sec).................260
Electrostatic Discharge, VESD
Human body mode............................................2000V(2)
SOP-8L Thermal Resistance (JA).......................130/W
SOP-8L (FD) Thermal Resistance (JA)..............50/W(3)
SOP-8L (FD) Thermal Resistance (JA)..............41/W(4)
SOP-8L (FD) Thermal Resistance (Jc)...................12/W
Operating Ambient Temperature Range
TA................................................................40 to +85
AVIN to GND................................................1.6V to +5.5V
PVIN, VDDQ to GND.......................................1.6V to AVIN
Note:
(1) : Absolute maximum rating indicates limits beyond which damage to the
device may occurs.
(2) : Human body model : C = 100pF, R = 1500, 3 positive pulses plus
3 negative pulses
(3) : The package is placed on a 2-layer PCB (2oz/2oz) with 6 vias.
(4) : The package is placed on a 2-layer PCB (2oz/2oz) with 6 vias. The airflow
is used.
G2995 Features
· Operation Supply Voltage: 1.6V to 5.5V
· Low Supply Current: 280µA @ 2.5V
· Low Output Offset
· Source and Sink Current
· Low External Component Count
· No Inductor Required
· No external Resistors Required
· Thermal Shutdown Protection
· SOP-8L with Power-Pad package
· Low Supply Current: 280µA @ 2.5V
· Low Output Offset
· Source and Sink Current
· Low External Component Count
· No Inductor Required
· No external Resistors Required
· Thermal Shutdown Protection
· SOP-8L with Power-Pad package
G2995 Typical Application
· DDR-SDRAM Termination Voltage
· DDR-I / DDR-II Termination Voltage
· SSTL-2
· SSTL-3
· DDR-I / DDR-II Termination Voltage
· SSTL-2
· SSTL-3
G2995 Connection Diagram
G2996 General Description
The G2996 is a linear regulator designed to meet the JEDEC SSTL-18 ,SSTL-2 and SSTL-3 (Series Stub Termination Logic) specifications for termination of DDR-SDRAM. It contains a high-speed operational amplifier that provides excellent response to the load transients. This device can deliver 1.5A/0.9A continuous current and transient peaks up to 3A/1.8A in the application as required for DDRI/II-SDRAM termination. With an independent VSENSE pin, the G2996 can provide superior load regulation. The G2996 provides a VREF output as the reference for the applications of the chipset and DIMMs.
The G2996 can easily provide the accurate VTT and VREF voltages without external resistors that PCB areas can be reduced. The quiescent current is as low as 280A @ 2.5V. So the power consumption can meet the low power consumption applications.
The G2996 also has an active low shutdown (SD ) pin that provides Suspend to RAM (STR) functionality. When SD is pulled low, the VTT output will be tri-state providing a high impendence, but VREF will remain active. A power saving advantage can be obtained in this mode through lowering the quiescent current to180A @ 2.5V.
G2996 Maximum Ratings
Supply Voltage
PVIN, AVIN, VDDQ to GND . . . . . . . . . . . -0.3V to +6V
Operating Ambient Temperature Range
TA . . . . . . . . . . . . . . . . . . . . . . . . . . .-40 to +125
Maximum Junction Temperature, TJ . . . . . . . . ..150
Storage Temperature Range, TSTG . . -65 to+150
Reflow Temperature (soldering, 10 sec) . . . .. .260
Electrostatic Discharge, VESD
Human body mode . . . . . . . . . . . . . . . . . . .2000V(2)
Thermal Resistance Junction to Ambient, (JA)
SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . .130/W
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . ..110/W(3)
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . 50/W(4)
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . 41/W(5)
Thermal Resistance Junction to Case, (JC)
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . . ..12/W
Operating Ambient Temperature Range
TA . . . . . . . . . . . . . . . . . . . . . . . . . . ..-40 to +85
AVIN to GND . . . . . . . . . . . . . . . . . . .. 1.6V to +5.5V
PVIN, SD, VDDQ to GND . . . . . . . . . . . . 1.6V to AVIN
Note:
(1) : Absolute maximum rating indicates limits beyond which damage to the device may occurs.
(2) : Human body model : C = 100pF, R = 1500, 3 positive pulses plus 3 negative pulses
(3): The package is placed on a 2-layer PCB (1oz/1oz) with minimum footprint.
(4): The package is placed on a 2-layer PCB (2oz/2oz) with 6 vias. Please refer the evaluation
board manual (EV2996-10) for pcb layout.
(5): The package is placed on a 2-layer PCB (2oz/2oz) with 6 vias. The airflow is used. Please
refer the evaluation board manual (EV2996-10) for pcb layout.
PVIN, AVIN, VDDQ to GND . . . . . . . . . . . -0.3V to +6V
Operating Ambient Temperature Range
TA . . . . . . . . . . . . . . . . . . . . . . . . . . .-40 to +125
Maximum Junction Temperature, TJ . . . . . . . . ..150
Storage Temperature Range, TSTG . . -65 to+150
Reflow Temperature (soldering, 10 sec) . . . .. .260
Electrostatic Discharge, VESD
Human body mode . . . . . . . . . . . . . . . . . . .2000V(2)
Thermal Resistance Junction to Ambient, (JA)
SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . .130/W
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . ..110/W(3)
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . 50/W(4)
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . 41/W(5)
Thermal Resistance Junction to Case, (JC)
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . . ..12/W
Operating Ambient Temperature Range
TA . . . . . . . . . . . . . . . . . . . . . . . . . . ..-40 to +85
AVIN to GND . . . . . . . . . . . . . . . . . . .. 1.6V to +5.5V
PVIN, SD, VDDQ to GND . . . . . . . . . . . . 1.6V to AVIN
Note:
(1) : Absolute maximum rating indicates limits beyond which damage to the device may occurs.
(2) : Human body model : C = 100pF, R = 1500, 3 positive pulses plus 3 negative pulses
(3): The package is placed on a 2-layer PCB (1oz/1oz) with minimum footprint.
(4): The package is placed on a 2-layer PCB (2oz/2oz) with 6 vias. Please refer the evaluation
board manual (EV2996-10) for pcb layout.
(5): The package is placed on a 2-layer PCB (2oz/2oz) with 6 vias. The airflow is used. Please
refer the evaluation board manual (EV2996-10) for pcb layout.
G2996 Features
`Operation Supply Voltage: 1.6V to 5.5V
`Low Supply Current: 280A @ 2.5V
`Low Output Offset
`Source and Sink Current
`Low External Component Count
`No Inductor Required
`No external Resistors Required
`Thermal Shutdown Protection
`Suspend to RAM (STR) function
`SOP-8 with Power-Pad package
`Low Supply Current: 280A @ 2.5V
`Low Output Offset
`Source and Sink Current
`Low External Component Count
`No Inductor Required
`No external Resistors Required
`Thermal Shutdown Protection
`Suspend to RAM (STR) function
`SOP-8 with Power-Pad package
G2996 Typical Application
·DDR-SDRAM Termination Voltage
·DDR-I / DDR-II Termination Voltage
·SSTL-2
·SSTL-3
·DDR-I / DDR-II Termination Voltage
·SSTL-2
·SSTL-3
G2996 Connection Diagram
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