HMC264, HMC265, HMC266 Selling Leads, Datasheet
MFG:HITTITE Package Cooled:N/A D/C:2010+
HMC264, HMC265, HMC266 Datasheet download

Part Number: HMC264
MFG: HITTITE
Package Cooled: N/A
D/C: 2010+
MFG:HITTITE Package Cooled:N/A D/C:2010+
HMC264, HMC265, HMC266 Datasheet download

MFG: HITTITE
Package Cooled: N/A
D/C: 2010+
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PDF/DataSheet Download
Datasheet: HMC264
File Size: 319232 KB
Manufacturer: HITTITE [Hittite Microwave Corporation]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HMC265
File Size: 225460 KB
Manufacturer: HITTITE [Hittite Microwave Corporation]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HMC266
File Size: 172952 KB
Manufacturer: HITTITE [Hittite Microwave Corporation]
Download : Click here to Download
The HMC264 chip is a sub-harmonically pumped (x2) MMIC mixer with an integrated LO amplii er which can be used as upconverter or downconverter. The chip utilizes a GaAs PHEMT technology that results in a small overall chip ea .28mm The 2LO to RF isolation is excellent eliminating the need for additional i ltering. The LO amplii er is a single bias (+3V to +4V) two stage design with only -4 dBm nominal drive requirement. All data is measured with the chip in a 50 ohm test i xture connected via 0.025 mm (1 mil) diameter wire bonds of minimal length <0.31 mm (<12 mils).
| RF / IF Input (Vdd = +4V) | +13 dBm |
| LO Drive (Vdd = +4V) | +13 dBm |
| Vdd | +5.5 Vdc |
| Storage Temperature | -65 to +150 |
| Operating Temperature | -55 to +85 |
The HMC265 chip is a sub-harmonically pumped (x2) MMIC downconverter with integrated LO & IF amplifi ers. The chip utilizes a GaAs PHEMT technology that results in a small overall chip area of 1.74 mm2. The 2LO to RF isolation is excellent eliminating the need for additional fi ltering. The LO amplifi er is a single bias (+3V to +4V) two stage design with only -4 dBm nominal drive requirement. All data is with the chip in a 50 ohm test fi xture connected via 0.025 mm (1 mil) diameter wire bonds of minimal length <0.31 mm (<12 mils). This downconverter IC is an excellent, smaller, and more reliable replacement to hybrid diode based downconverter MMIC assemblies.
| RF / IF Input (Vdd = +4V) |
+13 dBm |
| LO Drive (Vdd = +4V) | +13 dBm |
| Vdd | +5.5V |
| Storage Temperature | -65 to +150 °C |
| Operating Temperature | -55 to +85 °C |
The HMC266 chip is a broadband GaAs MMIC sub-harmonically pumped (x2) balanced passive mixer which can be used as an upconverter or downconverter in a small overall chip area of 1.9 mm2. The 2LO to RF isolation is excellent eliminating the need for additional fi ltering. All data is with the chip in a 50 ohm test fi xture connected via 0.076 mm (3 mil) ribbon bonds of minimal length <0.31 mm (<12 mils). These devices are much smaller and more reliable than hybrid diode mixer designs.
| RF / IF Input | +13 dBm |
| LO Drive | +23 dBm |
| Storage Temperature | -65 to +150 |
| Operating Temperature | -55 to +85 d |
