HMC520LC4, HMC522LC4, HMC52L Selling Leads, Datasheet
MFG:HITTITE Package Cooled:2008+ROHS D/C:07+
HMC520LC4, HMC522LC4, HMC52L Datasheet download

Part Number: HMC520LC4
MFG: HITTITE
Package Cooled: 2008+ROHS
D/C: 07+
MFG:HITTITE Package Cooled:2008+ROHS D/C:07+
HMC520LC4, HMC522LC4, HMC52L Datasheet download

MFG: HITTITE
Package Cooled: 2008+ROHS
D/C: 07+
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PDF/DataSheet Download
Datasheet: HMC1001
File Size: 236544 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HMC1001
File Size: 236544 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HMC1001
File Size: 236544 KB
Manufacturer:
Download : Click here to Download
The HMC520LC4 is a compact I /Q MMIC mixer in a leadless "Pb free" SMT package, which can be used as either an Image Reject Mixer or a Single Sideband Upconverter. The mixer utilizes two standard Hittite double balanced mixer cells and a 90 degree hybrid fabricated in a GaAs MESFET process. A low frequency quadrature hybrid was used to produce a 100 MHz USB IF output. This product is a much smaller alternative to hybrid style Image Reject Mixers and Single Sideband Upconverter assemblies. The HMC520LC4 eliminates the need for wire bonding allowing use of surface mount manufacturing techniques.
| RF/IF Input | +20 dBm |
| LO Drive | + 27 dBm |
| Channel Temperature | 150 |
| Continuous Pdiss (T=85 ) (derate 6.9 mW/ above 85) |
508 mW |
| Thermal Resistance (RTH) (junction to package bottom) |
128.2 /W |
| Storage Temperature | -65 to +150 |
| Operating Temperature | -55 to +85 |
The HMC522LC4 is a compact I /Q MMIC mixer in a leadless "Pb free" SMT package, which can be used as either an Image Reject Mixer or a Single Sideband Upconverter. The mixer utilizes two standard Hittite double balanced mixer cells and a 90 degree hybrid fabricated in a GaAs MESFET process. A low frequency quadrature hybrid was used to produce a 100 MHz USB IF output. This product is a much smaller alternative to hybrid style Image Reject Mixers and Single Sideband Upconverter assemblies. The HMC522LC4 eliminates the need for wire bonding allowing use of surface mount manufacturing techniques.
| RF / IF Input | +20 dBm |
| LO Drive | +27 dBm |
| Channel Temperature | 150 |
| Continuous Pdiss (T = 85 ) (derate 9.83 mW/°C above 85 ) |
452 mW |
| Thermal Resistance (RTH) (junction to die bottom) |
150 /W |
| Storage Temperature | -65 to +150 |
| Operating Temperature | -55 to +85deg |

