HMC524, HMC524LC3B, HMC524LC4 Selling Leads, Datasheet
MFG:HITTITE Package Cooled:N/A D/C:2010+
HMC524, HMC524LC3B, HMC524LC4 Datasheet download

Part Number: HMC524
MFG: HITTITE
Package Cooled: N/A
D/C: 2010+
MFG:HITTITE Package Cooled:N/A D/C:2010+
HMC524, HMC524LC3B, HMC524LC4 Datasheet download

MFG: HITTITE
Package Cooled: N/A
D/C: 2010+
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Datasheet: HMC1001
File Size: 236544 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HMC1001
File Size: 236544 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HMC1001
File Size: 236544 KB
Manufacturer:
Download : Click here to Download
The HMC524 is a compact I /Q MMIC mixer which can be used as either an Image Reject Mixer or a Single Sideband Upconverter. The chip utilizes two standard Hittite double balanced mixer cells and a 90 degree hybrid fabricated in a GaAs MESFET process. All data shown below is taken with the chip mounted in a 50 Ohm test fi xture and includes the effects of mil diameter x 20 mil length bond wires on each port. A low frequency quadrature hybrid was used to produce a 100 MHz USB IF output. This product is a much smaller alternative to hybrid style Image Reject Mixers and Single Sideband Upconverter assemblies.
|
RF / IF Input |
+13 dBm +27 dBm 150 641 mW 102 /W -65 to +150 -55 to +85 deg Class 1A |
The HMC524LC3B is a compact I/Q MMIC mixer which can be used as either an Image Reject Mixer or a Single Sideband Upconverter. The chip utilizes standard Hittite mixer cells and a 90 degree hybrid fabricated in a GaAs MESFET process. A low frequency quadrature hybrid was used to produce a 100 MHz USB IF output. This product is a much smaller alternative to hybrid style Image Reject mixers and single sideband upconverter assemblies. The HMC524LC3B eliminates the need for wirebonding, allowing the use of surface mount techniques.
| RF / IF Input | +20 dBm |
| LO Drive | +27 dBm |
| Channel Temperature | 150 |
| Continuous Pdiss (T=85) (derate 9.8 mW/ above 85) |
340 mW |
| Thermal Resistance (RTH) (junction to die bottom) |
191.5 /W |
| Storage Temperature | -65 to +150 |
| Operating Temperature | -55 to +85 |
| ESD Sensitivity (HBM) | Class 1A |

