MFG:International Rectifier Category:Integrated Circuits (ICs) Package Cooled:SMD24 D/C:2008+
IR2114SS, IR2115S, IR2116 Datasheet download
Category: Integrated Circuits (ICs)
MFG: International Rectifier
Package Cooled: SMD24
D/C: 2008+
Description: IC DRIVER HALF-BRIDGE 24-SSOP
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PDF/DataSheet Download
Datasheet: IR2114SS
File Size: 1899727 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: IR2010
File Size: 232500 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: IR2010
File Size: 232500 KB
Manufacturer: IRF [International Rectifier]
Download : Click here to Download
| Technical/Catalog Information | IR2114SS |
| Vendor | International Rectifier |
| Category | Integrated Circuits (ICs) |
| Configuration | Half Bridge |
| Voltage - Supply | 11.5 V ~ 20 V |
| Current - Peak | 2A |
| Delay Time | 440ns |
| Package / Case | 24-SSOP |
| Packaging | Tube |
| Number of Outputs | 2 |
| Input Type | Non-Inverting |
| Number of Configurations | 1 |
| Operating Temperature | -40°C ~ 125°C |
| High Side Voltage - Max (Bootstrap) | 600V |
| Lead Free Status | Contains Lead |
| RoHS Status | RoHS Non-Compliant |
| Other Names | IR2114SS IR2114SS |
The IR2114/21141/2214/IR22141 gate driver family is suited to drive a single half bridge in power switching applications. The high gate driving capability (2A source, 3A sink) and the low quiescent current enable bootstrap supply techniques in medium power systems. These drivers feature full short circuit protection by means of the power transistor desaturation detection and manages all the half-bridge faults by turning off smoothly the desaturated transistor through the dedicated soft shut down pin, therefore preventing over-voltages and reducing EM emissions. In multi-phase system IR2114/21141/2214/IR22141 drivers communicate using a dedicated local network (SY_FLT and FAULT/SD signals) to properly manage phase-to-phase short circuits. The system controller may force shutdown or read device fault state through the 3.3 V compatible CMOS I/O pin (FAULT/SD). To improve the signal immunity from DC-bus noise, the control and power ground use dedicated pins enabling low-side emitter current sensing as well. Undervoltage conditions in floating and low voltage circuits are managed independently.
| Symbol | Definition | Min. | Max. | Units | |
| VS | High side offset voltage | VB - 25 | VB + 0.3 | V | |
| VB | High side floating supply voltage | (IR2114 or IR21141) | -0.3 | 625 | |
| (IR2214 or IR22141) | -0.3 | 1225 | |||
| VHO | High side floating output voltage (HOP, HON and SSDH) | VS - 0.3 | VB + 0.3 | ||
| VCC | Low side and logic fixed supply voltage | -0.3 | 25 | ||
| COM | Power ground | VCC - 25 | VCC + 0.3 | ||
| VLO | Low side output voltage (LOP, LON and SSDL) | VCOM -0.3 | VCC + 0.3 | ||
| VIN | Logic input voltage (HIN, LIN and FLT_CLR) | VSS -0.3 | VCC + 0.3 | ||
| VFLT | FAULT input/output voltage (FAULT/SD and SY_FLT) | VSS -0.3 | VCC + 0.3 | ||
| VDSH | High side DS input voltage | VS -3 | VB + 0.3 | ||
| VDSL | Low side DS input voltage | VCOM -3 | VCC + 0.3 | ||
| dVs/dt | Allowable offset voltage slew rate | - | 50 | V/ns | |
| PD | Package power dissipation @ TA +25 | - | 1.5 |
W | |
| RthJA | Thermal resistance, junction to ambient | - | 65 | /W | |
| TJ | Junction temperature | - | 125 | ||
| TS | Storage temperature | -55 | 150 | ||
| TL | Lead temperature (soldering, 10 seconds) | - | 300 | ||
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