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Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300
°C
IXSR40N60BD1 Features
• DCB Isolated mounting tab • Meets TO-247AD package Outline • High current handling capability • Latest generation HDMOSTM process • MOS Gate turn-on - drive simplicity
IXSR40N60BD1 Typical Application
• Uninterruptible power supplies (UPS) • Switched-mode and resonant-mode power supplies • AC motor speed control • DC servo and robot drives • DC choppers
Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300
°C
Weight
6
g
IXST30N60BD1 Features
• International standard packages: JEDEC TO-247, TO-264& TO-268 • Short Circuit SOA capability • Medium freqeuncy IGBT and antiparallel FRED in one package • New generation HDMOSTM process
IXST30N60BD1 Typical Application
• AC motor speed control • DC servo and robot drives • DC choppers • Uninterruptible power supplies (UPS) • Switch-mode and resonant-mode power supplies
