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Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300
°C
IXST30N60B Features
· International standard packages · Short Circuit SOA capability · High frequency IGBT New generation HDMOSTM process
IXST30N60B Typical Application
· AC motor speed control · DC servo and robot drives · DC choppers · Uninterruptible power supplies (UPS) · Switch-mode and resonant-mode power supplies
Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300
°C
IXST30N60C Features
· International standard packages · Short Circuit SOA capability · High frequency IGBT New generation HDMOSTM process
IXST30N60C Typical Application
· AC motor speed control · DC servo and robot drives · DC choppers · Uninterruptible power supplies (UPS) · Switch-mode and resonant-mode power supplies